EP3SE260F1517C3N vs EP3SE260F1517I3G Comparación
Comparación detallada lado a lado de EP3SE260F1517C3N por Intel y EP3SE260F1517I3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE260F1517C3N | EP3SE260F1517I3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $9.850,00 | $3.520,00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 254,400 | 255,000 |
| Embedded Memory | 16,672,768 bits (16.7 Mbits) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 Multipliers) | 816 | — |
| M9K Memory Blocks | 1,040 | — |
| Maximum Transceiver Data Rate | 600 Mbps | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| Encapsulado | 1517-BBGA (FCBGA) | 1517-ball FC-FBGA (Flip-Chip BGA) |
| Process Technology | 65 nm TSMC low-power CMOS | — |
| Speed Grade | C3 (commercial) | — |
| Temperatura de unión de funcionamiento | 0 C to +85 C (commercial) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | — |
| External Memory Interfaces | DDR3, DDR2, QDRII+, RLDRAM2 | — |
| Embedded Memory Bits | — | 16,672,768 |
| Maximum Operating Frequency | — | 500 MHz |
| Core Voltage | — | 1.1 V |
| User I/O Count | — | 976 |
| Process Node | — | 65 nm |
| Embedded Multipliers | — | 768 (18x18) |
| PLL Count | — | 12 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Lead-Free / RoHS | — | Yes (RoHS compliant per DigiKey listing) |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |