EP3SE260F1517I3G - Stratix III E FPGA 255K LE 1517-FBGA | Intel
N.º de pieza: EP3SE260F1517I3G ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $4250 | $4.250,00 |
| 10 | $3995 | $39.950,00 |
| 50 | $3810 | $190.500,00 |
| 100 | $3675 | $367.500,00 |
| 250 | $3520 | $880.000,00 |
EP3SE260F1517I3G Descripción general
What is an FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, embedded memory, and hardened I/O serdes that can be rewired after manufacture by the end user. Within the FPGA hierarchy, the Stratix III family sits as the high-performance, ASIC-prototyping flagship tier, and the -E variant emphasizes logic density and DSP capability. FPGAs in general belong to the broader class of programmable logic devices (PLDs), which also include CPLDs and PALs, occupying the same role as a customizable alternative to fixed-function ASICs.
Key features of the EP3SE260F1517I3G include 8.7 Mbits of embedded RAM (TriMatrix memory with MLAB, M9K, and M144K blocks), 768 embedded 18x18 multipliers for DSP, 12 PLLs, and a rich multi-protocol transceiver engine supporting rates up to 6.375 Gbps. The device implements a true 1.0 V core voltage and is built in TSMC's 65 nm process node, balancing leakage and performance. Adaptive Logic Modules (ALMs) replace traditional 4-input LUTs, giving an effective 2.3x density improvement over Stratix II.
Technical depth: The Stratix III E architecture introduces programmable power technology that lets unused logic, memory, and DSP blocks enter a low-power state, while the I/O subsystem supports LVDS, LVTTL, LVCMOS, HSTL, SSTL, and LVPECL with dynamic on-chip termination (OCT). Partial reconfiguration and remote update via PCI Express or serial flash are supported in silicon, allowing in-system logic changes without full reconfiguration.
Typical applications include high-end ASIC prototyping, telecommunications infrastructure, high-throughput signal processing, military radar, test and measurement instrumentation, and wireline backplane bridging. The wide transceiver aggregate bandwidth (over 600 Gbps full duplex in some configurations) makes the device suitable for protocols such as PCIe Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, and Interlaken.
When designing with the EP3SE260F1517I3G, attention must be paid to PCB signal-integrity for the 1517-ball FC-FBGA substrate, multi-rail power sequencing (1.1 V core, 2.5 V PLL, VCCAUX, VCCIO banks), and thermal management; a thermal-resistance-aware heatsink is recommended at full utilization.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix III E family, and practical design notes not collated in the manufacturer datasheet, giving engineers a one-stop reference for sourcing and replacement decisions.
Alternativas directas para EP3SE260F1517I3G — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP3SE260F1517I3G (mismo factor de forma y huella) — difiere en Package, Speed Grade, Family, Operating Temperature, Process Technology.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP3SE260F1517I3
✅ Sustitución directa✓ En stock
$10500 / unidad
Ver hoja de datos →EP3SE260F1517C4N
✅ Sustitución directa✓ En stock
$7800 / unidad
Ver hoja de datos →EP3SE260F1517C4
✅ Sustitución directa✓ En stock
$8400 / unidad
Ver hoja de datos →EP3SE260F1517C3N
✅ Sustitución directa✓ En stock
$9850 / unidad
Ver hoja de datos →EP3SE260F1517C3
✅ Sustitución directa✓ En stock
$10800 / unidad
Ver hoja de datos →EP3SE260F1517C2N
✅ Sustitución directa✓ En stock
$4750 / unidad
Ver hoja de datos →EP3SE260F1517C2G
✅ Sustitución directa✓ En stock
$2050 / unidad
Ver hoja de datos →EP3SE260F1517I3G Valores máximos y características eléctricas
| Family | Stratix III E |
| Logic Elements | 255,000 |
| Embedded Memory Bits | 16,672,768 |
| Maximum Operating Frequency | 500 MHz |
| Core Voltage | 1.1 V |
| User I/O Count | 976 |
| Encapsulado | 1517-ball FC-FBGA (Flip-Chip BGA) |
| Tipo de montaje | Surface Mount |
| Process Node | 65 nm |
| Embedded Multipliers | 768 (18x18) |
| PLL Count | 12 |
| Transceiver Data Rate | Up to 6.375 Gbps |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Lead-Free / RoHS | Yes (RoHS compliant per DigiKey listing) |
Guía de configuración de pines de EP3SE260F1517I3G 1517-ball fc-fbga (flip-chip bga)
Configuración de pines para EP3SE260F1517I3G (encapsulado 1517-ball fc-fbga (flip-chip bga)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP3SE260F1517I3G.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP3SE260F1517I3G es adecuado para 6 aplicacións: ASIC Prototyping, Telecommunications Infrastructure, High-Throughput DSP / Signal Processing, Test and Measurement Instrumentation, Military and Aerospace Radar, Wireline Backplane Bridging.
ASIC Prototyping
The EP3SE260F1517I3G is well-suited for ASIC prototyping because it offers 255,000 logic elements, 16.6 Mbits of embedded memory, and 768 18x18 multipliers - sufficient capacity to map large ASIC netlists for pre-silicon validation. Quartus II synthesis flows map RTL directly to the Stratix III E ALM architecture with timing-driven results within 10-15 percent of final silicon. Placed on a standard 1517-ball FC-FBGA carrier PCB, the part supports PCIe Gen2, Serial RapidIO, and DDR3 interfaces common in ASIC prototyping scenarios. The trade-off is engineering effort to meet timing closure on dense designs.
Recomendado
Telecommunications Infrastructure
Telecommunications infrastructure applications leverage the EP3SE260F1517I3G for high-throughput packet processing and baseband DSP. The 12 on-chip PLLs and multi-protocol transceivers supporting up to 6.375 Gbps enable protocols like PCIe Gen2, Serial RapidIO, and Interlaken for backplane bridging. The 976 user I/Os are organized across 8 I/O banks supporting LVDS, HSTL, and SSTL standards required by telecom line cards. Operating at 500 MHz internal frequency with industrial temperature grade, the device meets telecom NEBS thermal requirements with proper heatsinking.
Recomendado
High-Throughput DSP / Signal Processing
The 768 embedded 18x18 multipliers deliver up to 1.5 TMACS (Mega Multiply-Accumulates per second) on the EP3SE260F1517I3G, enabling real-time FFT, FIR, and modulation/demodulation for radar and software-defined radio. The TriMatrix memory architecture (MLAB + M9K + M144K blocks) provides on-chip buffering that avoids expensive external memory accesses in radar pulse-processing pipelines. Industrial temperature grade and 500 MHz internal performance enable deployment in defense and instrumentation systems. The dense DSP and logic resource mix positions this part for computationally intensive signal-processing workloads.
Recomendado
Test and Measurement Instrumentation
Test and measurement instrumentation uses the EP3SE260F1517I3G for arbitrary waveform synthesis, real-time data acquisition, and protocol-aware test pattern generation. The 16.6 Mbits of embedded memory acts as deep sample buffers, while 976 user I/Os enable parallel LVDS acquisition channels. The transceiver aggregate bandwidth supports high-speed serial test interfaces (PCIe, SATA, USB 3.0 via external PHY). With Quartus II DSP Builder and DSP development kits, engineers accelerate development of high-channel-count oscilloscopes and protocol analyzers.
Recomendado
Military and Aerospace Radar
Military radar systems deploy the EP3SE260F1517I3G for phased-array beamforming, pulse compression, and SAR (Synthetic Aperture Radar) image processing. The 768 multipliers support real-time FFT and chirp processing, while the industrial temperature range (-40C to +100C) meets MIL-STD-810 shock and vibration requirements when paired with a conduction-cooled heatsink. The 976 user I/Os accommodate multi-channel ADC/DAC interfacing for active electronically scanned arrays (AESA). The 65 nm process and programmable power technology provide radiation tolerance margin for low-earth-orbit deployments.
Recomendado
Wireline Backplane Bridging
Wireline backplane bridging applications leverage the EP3SE260F1517I3G transceiver aggregate bandwidth (over 600 Gbps full duplex in the E variant) for multi-protocol bridging between ATCA/AdvancedTCA shelves. The 12 PLLs and dynamic reconfiguration capability support protocol changes without powering down the system. Industrial temperature grade and lead-free compliance meet telecom backplane reliability and environmental requirements. The 1517-ball FC-FBGA package with 976 user I/Os enables direct attachment to backplane connectors via standard BGA-to-board PCB design rules.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP3SE260F1517I3G — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP3SE260F1517I3 | EP3SE260F1517C4N | EP3SE260F1517C4 | EP3SE260F1517C3N | EP3SE260F1517C2G |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Package | 1517-ball FC-FBGA | 1517-ball FC-FBGA - same | 1517-ball FC-FBGA - same | 1517-ball FC-FBGA - same | 1517-ball FC-FBGA - same | 1517-ball FC-FBGA - same |
| Logic Elements | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 |
| Speed Grade | I3 (industrial, fast) | I3 - same | C4 (commercial, slower) | C4 - same | C3 - slightly slower than I3 | C2 - slowest C-tier |
| Temperature Grade | Industrial (-40C to +100C) | Industrial - same | Commercial (0C to +85C) | Commercial - same | Commercial - same | Commercial - same |
| Lead-Free / RoHS | Yes (G suffix) | No (standard lead finish) | Yes (N suffix) | No (standard) | Yes (N suffix) | Yes (G suffix) |
| User I/O Count | 976 | 976 - same | 976 - same | 976 - same | 976 - same | 976 - same |
| Embedded Memory (bits) | 16,672,768 | 16,672,768 - same | 16,672,768 - same | 16,672,768 - same | 16,672,768 - same | 16,672,768 - same |
Diferenciadores clave
- RoHS lead-free compliance via 'G' suffix designation (frente a EP3SE260F1517I3)
- Fastest speed grade in the Stratix III E 260K F1517 family (frente a EP3SE260F1517C4N)
- Industrial temperature range -40C to +100C (frente a EP3SE260F1517C2G)
Notas de diseño
Estimated: At full logic utilization (~80 percent) running at 500 MHz, the EP3SE260F1517I3G can dissipate 8-12 W. The 1517-ball FC-FBGA package has a typical theta_JA in the 15-25 C/W range without airflow, giving a junction temperature rise of 120-300 C above ambient at full load. A conduction-cooled heatsink or 200 LFM airflow is required for industrial temperature deployments. Plan thermal relief at the PCB level (thermal via array under the BGA) for sustained high-utilization workloads.
The 1517-ball FC-FBGA requires a 1.0 mm or 1.27 mm pitch BGA PCB footprint with 4-6 mil trace/space rules and a microvia stack-up (4-6-4 minimum, 8-layer recommended). Decoupling must include a 0.1 uF X7R capacitor per VCCIO/VCC pin pair within 100 mils of each ball, plus 10 uF and 100 uF bulk capacitors per power rail. The transceiver channels require 100 ohm differential impedance and length-matched routing within 5 mil tolerance.
Common pitfalls with EP3SE260F1517I3G designs include: (1) failing to implement the multi-rail power sequencing requirement (1.1 V core, 2.5 V PLL analog, VCCAUX, VCCIO bank supplies - sequence within 100 ms per Altera power management guidelines); (2) omitting the MSEL pin pull resistors required for configuration mode selection; (3) using wrong JTAG chain order when multiple Altera devices share the chain; (4) ignoring the I/O bank VCCIO compatibility when mixing LVDS and LVCMOS in the same bank.
Signal-integrity best practices: Use IBIS models from the Altera website for SI simulation; route high-speed transceivers on the top PCB layer with a continuous ground plane beneath; avoid layer transitions on >3 Gbps channels; length-match DDR3/2 memory interfaces within 25 ps on the same byte lane; implement on-chip termination (OCT) for LVDS and SSTL signals rather than external resistor networks.
Información de cumplimiento
RoHS compliance confirmed by DigiKey product listing (10818170) and Altera 'G' suffix designation. REACH and halogen-free status not stated in available data. AEC-Q100 not applicable - FPGAs are not automotive-qualified at this density tier.
