EP3SE260F1517C4LN vs EP3SE260F1517C4 Comparación
Comparación detallada lado a lado de EP3SE260F1517C4LN por Intel y EP3SE260F1517C4 por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel
EP3SE260F1517C4LN ⚠ Última compraComparación de especificaciones
| Parámetro | EP3SE260F1517C4LN | EP3SE260F1517C4 |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.450,00 | $8.400,00 |
| Series | Stratix III E | Stratix III E |
| Family | Stratix III E (Enhanced) | Stratix® III E FPGA |
| Logic Elements | 255,000 | — |
| Number of LABs/CLBs | 10,200 | — |
| Total Memory Bits | 16,672,768 (16.67 Mbit) | — |
| Number of I/O | 976 | — |
| Number of Gates | [DATA_NEEDED: gate count not published in web data] | — |
| Voltage - Supply | 0.9 V to 1.1 V core | — |
| Operating Frequency | 375 MHz to 450 MHz (per family) | — |
| Process Technology | 65 nm | — |
| Encapsulado / Carcasa | 1517-BBGA, FCBGA (FC-FBGA) | — |
| Tipo de montaje | Surface Mount (flip-chip) | Surface Mount |
| Temperatura de funcionamiento | 0C to +85C (commercial grade per 'C' suffix) | Commercial (0C to +85C) - inferred from C4 suffix |
| Nivel de sensibilidad a la humedad (MSL) | 3 (168 Hours) | — |
| Packaging | Tray | — |
| Speed Grade | C4 | -4 |
| Lead-Free / Halogen-Free | Yes (LN suffix) | — |
| Estado RoHS | Compliant | Compliant (per Altera product page) |
| Logic Elements (LE) | — | 255,000 |
| Adaptive Logic Modules (ALM) | — | 10,200 LABs / 10200 ALMs (per Mouser listing) |
| Embedded Memory (bits) | — | 16,672,768 |
| User I/O Count | — | 976 |
| DSP Blocks | — | 768 (18x18 multipliers per Mouser listing) |
| Encapsulado | — | 1517-BBGA, FCBGA |
| Ball Count | — | 1517 |
| Package Style | — | Flip-Chip BGA |
| Process Node | — | 40 nm |
| Lead-Free | — | Yes |