EP3SE260F1517I4L vs EP3SE260F1517C4N Comparación
Comparación detallada lado a lado de EP3SE260F1517I4L por Intel y EP3SE260F1517C4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE260F1517I4L | EP3SE260F1517C4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.800,00 | $7.800,00 |
| Family | Stratix III Enhanced (E) | Field-Programmable Gate Array (FPGA) |
| Series | Stratix III | Stratix® III E |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory | 16,672,768 bits (16.6 Mbits) | 16,672,768 bits |
| Maximum User I/O | 976 | — |
| Package Type | 1517-BBGA, FCBGA | — |
| Package Dimensions | 40 mm x 40 mm (BGA1517, 39x39, 1.0 mm pitch) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | 0°C to 85°C |
| Temperature Grade | Industrial | — |
| Speed Grade | I4 | — |
| Lead-Free / RoHS | Yes (L suffix) | — |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | — |
| Process Technology | 65 nm CMOS | — |
| DSP Blocks (18x18 Multipliers) | 768 | — |
| Configuration Method | JTAG, Passive Serial, Fast Passive Parallel | — |
| Nivel MSL | 3 (per JEDEC J-STD-020) | [DATA_NEEDED: MSL level] |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Logic Array Blocks (LABs) | — | 10,200 |
| Maximum User I/Os | — | 976 |
| Encapsulado | — | 1517-BBGA, FCBGA |
| Core Voltage | — | 0.9 V |
| Process Node | — | 65 nm |
| Lead Free | — | [DATA_NEEDED: lead-free status] |
| Maximum Transceiver Data Rate | — | 12.5 Gbps |