EP3SE260F1517C4N - Stratix III E FPGA 16.7M Gates 1517-BGA | Intel
N.º de pieza: EP3SE260F1517C4N ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $9698.58 | $9.698,58 |
| 5 | $9200 | $46.000,00 |
| 10 | $8850 | $88.500,00 |
| 25 | $8400 | $210.000,00 |
| 100 | $7800 | $780.000,00 |
EP3SE260F1517C4N Descripción general
What is an FPGA? A Field-Programmable Gate Array is a type of programmable logic device (PLD) - part of the semiconductor hierarchy of programmable logic -> logic IC -> integrated circuit. Unlike fixed-function ASICs, an FPGA contains an array of configurable logic blocks (CLBs/LABs), routing interconnect, embedded memory blocks, DSP blocks, and high-speed transceivers that the engineer can program after manufacturing using a hardware description language (HDL) such as VHDL or Verilog. FPGAs are widely used for prototyping, low-volume production, and applications that demand hardware-level parallelism.
Key features of the EP3SE260F1517C4N include 976 maximum user I/Os, 16,672,768 embedded memory bits, 255,000 logic elements, and up to 10,200 LABs. The 1517-FCBGA package supports high I/O density and signal-integrity routing for multi-gigabit transceivers and external memory interfaces such as DDR3/QDRII+.
The Stratix III E family uses a low-power 65 nm process with programmable power technology, allowing unused logic and routing to be powered down. The device supports up to 12.5 Gbps transceivers and up to 800 MHz on-chip memory, making it suitable for high-bandwidth applications such as wireline communications, ASIC prototyping, and high-end test-and-measurement.
Typical applications include ASIC prototyping and emulation, high-speed serial protocol bridging (PCIe Gen2, Serial RapidIO, SFI-5.1), broadcast video processing, military/aerospace signal processing, and high-performance DSP for radar or medical imaging. Its 976 user I/Os and large memory footprint also fit telecom line-card designs.
When designing with this FPGA, plan power delivery carefully: the device requires multiple voltage rails (0.9 V core, 1.1 V/1.2 V/1.5 V/2.5 V/3.3 V I/O and transceiver supplies) with strict decoupling and sequence requirements. Use the Quartus II design software for HDL synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix III E family, and practical notes not found in the manufacturer datasheet.
Alternativas directas para EP3SE260F1517C4N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP3SE260F1517C4N (mismo factor de forma y huella) — difiere en Speed Grade, Package, Family, Operating Temperature, Operating Temperature Grade.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP3SE260F1517C4LN
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$1450 / unidad
Ver hoja de datos →EP3SE260F1517C4L
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$15100 / unidad
Ver hoja de datos →EP3SE260F1517C4
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$8400 / unidad
Ver hoja de datos →EP3SE260F1517C3N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$9850 / unidad
Ver hoja de datos →EP3SE260F1517C3
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$10800 / unidad
Ver hoja de datos →EP3SE260F1517C2N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$4750 / unidad
Ver hoja de datos →EP3SE260F1517C4N Valores máximos y características eléctricas
| Series | Stratix® III E |
| Family | Field-Programmable Gate Array (FPGA) |
| Logic Elements | 255,000 |
| Embedded Memory | 16,672,768 bits |
| Logic Array Blocks (LABs) | 10,200 |
| Maximum User I/Os | 976 |
| Encapsulado | 1517-BBGA, FCBGA |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | 0°C to 85°C |
| Core Voltage | 0.9 V |
| Process Node | 65 nm |
| Maximum Transceiver Data Rate | 12.5 Gbps |
Guía de configuración de pines de EP3SE260F1517C4N 1517-bbga, fcbga
Configuración de pines para EP3SE260F1517C4N (encapsulado 1517-bbga, fcbga). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP3SE260F1517C4N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP3SE260F1517C4N es adecuado para 6 aplicacións: ASIC Prototyping and Emulation, High-Speed Serial Protocol Bridging, Military and Aerospace Signal Processing, Broadcast Video Processing, High-Performance DSP for Radar/Medical Imaging, Industrial Test and Measurement.
ASIC Prototyping and Emulation
The EP3SE260F1517C4N's 255,000 logic elements and 16.7 Mbit embedded memory make it ideal for ASIC prototyping where designers partition their ASIC netlist into multiple FPGAs. With 976 user I/Os the device exposes enough pins to map wide on-chip buses between FPGA partitions. Compared to ASIC tape-out, the 65 nm Stratix III silicon cuts prototyping cost by orders of magnitude while running at usable MHz speeds for software validation. Designers use Quartus II synthesis and the TimeQuest timing analyzer to verify critical paths before committing to mask sets.
Recomendado
High-Speed Serial Protocol Bridging
The Stratix III E transceivers support up to 12.5 Gbps, which lets the EP3SE260F1517C4N bridge PCIe Gen2, Serial RapidIO, SFI-5.1, and 10G/40G Ethernet interfaces in telecom line cards. The 16.7 Mbit embedded memory absorbs packet bursts and aligns data across clock domains. Using the 1517-ball FCBGA with 976 user I/Os, designers route multiple SFP+ cages and external PHY interfaces without I/O starvation. Cyclone III HDL reference designs simplify PMA layer bring-up.
Recomendado
Military and Aerospace Signal Processing
The EP3SE260F1517C4N's 255K logic elements, embedded DSP blocks, and 976 I/Os support radar baseband processing, software-defined radio (SDR), and electronic-warfare signal chains. The 65 nm low-power Stratix III E architecture reduces thermal load in sealed enclosures where convection cooling is impossible. For Mil/Aero applications the commercial 0-85°C grade is acceptable in benign environments; extended-temperature parts (I-suffix variants) are required for avionics. Designers pair the FPGA with high-speed ADCs and DACs to digitize RF spectra.
Recomendado
Broadcast Video Processing
The Stratix III E EP3SE260F1517C4N supports uncompressed 3G-SDI / HD-SDI video pipelines with built-in transceivers and rich on-chip SRAM for line/frame buffers. Its 255K logic elements run real-time de-interlacing, scaling, and chroma keying across multiple video streams, while 976 user I/Os route multiple SDI inputs/outputs, HDMI bridges, and external DDR3 frame stores. Quartus II Video and Image Processing IP cores accelerate time-to-market for broadcast switchers and production switchers.
Recomendado
High-Performance DSP for Radar/Medical Imaging
The EP3SE260F1517C4N's 255K logic elements combined with dedicated DSP blocks perform FFTs, FIR filtering, and beamforming in ultrasound, MRI, and radar imaging front-ends. The 16.7 Mbit embedded memory holds coefficient tables and intermediate FFT bins without external memory round-trips, reducing latency to a few microseconds. With 976 user I/Os the FPGA connects to high-speed ADC/DAC lanes (e.g., 14-bit 250 MSPS converters) for real-time signal capture and processing.
Recomendado
Industrial Test and Measurement
The EP3SE260F1517C4N is used in high-end logic analyzers, protocol testers, and bit-error-rate testers (BERT) where 255K logic elements implement parallel pattern detection, scrambling, and 8b/10b encoding across hundreds of test channels. The 976 user I/Os interface to multi-channel probe heads, while the 12.5 Gbps transceivers drive high-speed serial links under test. Quartus II SignalTap II logic analyzer IP enables on-chip signal capture without external scopes.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP3SE260F1517C4N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP3SE260F1517C4LN | EP3SE260F1517C4L | EP3SE260F1517C4 | EP3SE260F1517C3N | EP3SE260F1517C2N | XC6VLX760-1FF1760 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Xilinx |
| Package | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA (same) | 1517-BBGA, FCBGA (same) | 1517-BBGA, FCBGA (same) | 1517-BBGA, FCBGA (same) | 1517-BBGA, FCBGA (same) | 1760-BBGA, FFG (different) |
| Logic Elements | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 | 758,000 logic cells |
| Maximum User I/Os | 976 | 976 | 976 | 976 | 976 | 976 | 1200 |
| Speed Grade | C4 (fastest) | C4 | C4 | C4 | C3 | C2 | -1 |
| Operating Temperature | 0°C to 85°C (commercial) | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C |
Diferenciadores clave
- Highest speed grade (C4) in the Stratix III E 260K-LE family (frente a EP3SE260F1517C3N)
- Largest I/O count Stratix III E option (1517-ball, 976 user I/Os) (frente a EP3SE260F1152C4N)
- Cross-brand migration path with higher logic density (frente a Xilinx XC6VLX760-1FF1760)
Notas de diseño
The Stratix III E EP3SE260F1517C4N requires multiple supply rails - 0.9 V core (VCC), VCCA (1.1 V PLL analog), and configurable VCCIO for each I/O bank (1.2 V/1.5 V/1.8 V/2.5 V/3.3 V). Decoupling per the Stratix III Device Handbook demands bulk capacitors of 220 uF per rail plus high-frequency 0.1 uF and 1 nF ceramics placed as close as possible to each power pin. Power sequencing requires VCCIO before VCC ramp, and the POR (power-on-reset) circuitry monitors the VCC ramp before releasing configuration logic.
In the 1517-ball FCBGA, the thermal slug is on the underside of the BGA and must be soldered to a thermal via array in the PCB top layer. At 65 nm the device can dissipate up to ~20 W in worst-case utilization; without adequate thermal vias the junction can exceed 125 C. Use at least 4 layers of 1 oz copper dedicated to thermal spreading, with a thermal via array in the BGA center pad that drops to an internal ground plane with stitched vias.
Route the high-speed transceiver channels (12.5 Gbps capable) using stripline geometry with 100 ohm differential impedance. Use the Quartus II board-level signal integrity tool to validate via stubs; back-drilling vias below the AC coupling capacitor is recommended when stubs exceed 100 mil. The 1517-ball FCBGA escape requires microvia (laser-drilled) stack-ups; standard 8-mil/12-mil through-via escape is too coarse for the 1 mm BGA pitch.
Estimated: Quartus II software is required for synthesis, place-and-route, and configuration. Quartus Prime 16.x is the last version with full Stratix III support - do not attempt to compile this device in newer Quartus versions targeting Stratix 10 only. Configuration via JTAG, Active Serial (EPCS), or Fast Passive Parallel must match the selected MSEL pin strapping on the board. Do not confuse EP3SE (Stratix III E) with EP3SL (Stratix III L) - they are different families with different logic densities and memory blocks.
Información de cumplimiento
EP3SE260F1517C4N is a Stratix III E FPGA in NRND status. Base C4N suffix indicates non-lead-free per legacy Altera convention. Lead-free variants carry LN or L suffix (e.g., EP3SE260F1517C4LN). RoHS/REACH data was not present in the verified distributor pages and is marked unknown. Not AEC-Q100 qualified (FPGA is not a discrete automotive-grade part).
