EP3SE260F1517I4N vs EP3SE260H780C3N Comparación
Comparación detallada lado a lado de EP3SE260F1517I4N por Intel y EP3SE260H780C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel
EP3SE260F1517I4N ⚠ Última compraIntel
EP3SE260H780C3N - Stratix III E FPGA, 255K LE, 780-BGA | Intel / Altera
EP3SE260H780C3N ✓ ActivoComparación de especificaciones
| Parámetro | EP3SE260F1517I4N | EP3SE260H780C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $10.500,00 | $1.325,00 |
| Series | Stratix III E | Stratix® III E |
| Logic Elements | 255,000 | — |
| Embedded Memory Bits | 16,672,768 bits | — |
| Embedded Memory (M9K/M144K blocks) | [DATA_NEEDED: total Kbits and block count] | — |
| User I/O Pins | 976 | — |
| Transceivers | [DATA_NEEDED: number of full-duplex channels] | [DATA_NEEDED: number of embedded transceivers and max data rate] |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: number of 18x18 multipliers] | [DATA_NEEDED: number of DSP blocks and precision] |
| PLLs | [DATA_NEEDED: total PLL count] | — |
| Core Voltage | 1.1 V | — |
| Process Technology | TSMC 65 nm | 40 nm CMOS |
| Encapsulado | 1517-BBGA, FCBGA | 780-BBGA, FCBGA (H780) |
| Package Body Size | [DATA_NEEDED: mm x mm] | — |
| Temperatura de funcionamiento | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (C grade, commercial) |
| Operating Temperature Grade | Industrial (I4) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Lead-Free / RoHS | [DATA_NEEDED: explicit RoHS statement] | — |
| Nivel MSL | [DATA_NEEDED: MSL classification] | — |
| Logic Elements (LE) | — | 255,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| Number of LABs/CLBs | — | 10,200 |
| User I/Os | — | 488 |
| Number of Pins / Balls | — | 780 |
| Maximum Core Frequency | — | [DATA_NEEDED: maximum core frequency MHz] |
| Supply Voltage (VCCINT) | — | [DATA_NEEDED: VCCINT nominal V] |
| Estado RoHS | — | Compliant (lead-free 'N' suffix) |
| Nivel de sensibilidad a la humedad (MSL) | — | [DATA_NEEDED: MSL level per JEDEC J-STD-020] |
| Configuration Method | — | SRAM-based, configured via JTAG / passive / active serial / fast passive parallel |
| Design Toolchain | — | Altera Quartus II (legacy); Intel Quartus Prime |