EP3SE260F1517I4N vs EP3SE260H780C3N 비교

다음의 상세 나란히 비교: EP3SE260F1517I4N 제조: Intel 및 EP3SE260H780C3N 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

Intel
EP3SE260F1517I4N EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel

EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel

EP3SE260F1517I4N ⚠ 최종 구매

사양 비교

파라미터 EP3SE260F1517I4N EP3SE260H780C3N
브랜드 Intel Intel
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 최종 구매 활성
재고 상태 In Stock In Stock
단가 (USD) $10,500.00 $1,325.00
Series Stratix III E Stratix® III E
Logic Elements 255,000 —
Embedded Memory Bits 16,672,768 bits —
Embedded Memory (M9K/M144K blocks) [DATA_NEEDED: total Kbits and block count] —
User I/O Pins 976 —
Transceivers [DATA_NEEDED: number of full-duplex channels] [DATA_NEEDED: number of embedded transceivers and max data rate]
Transceiver Data Rate 600 Mbps to 6.375 Gbps —
DSP Blocks [DATA_NEEDED: number of 18x18 multipliers] [DATA_NEEDED: number of DSP blocks and precision]
PLLs [DATA_NEEDED: total PLL count] —
Core Voltage 1.1 V —
Process Technology TSMC 65 nm 40 nm CMOS
패키지 1517-BBGA, FCBGA 780-BBGA, FCBGA (H780)
Package Body Size [DATA_NEEDED: mm x mm] —
동작 온도 -40 °C to +100 °C (Industrial) 0 °C to +85 °C (C grade, commercial)
Operating Temperature Grade Industrial (I4) —
실장 유형 Surface Mount (BGA) Surface Mount
Lead-Free / RoHS [DATA_NEEDED: explicit RoHS statement] —
MSL 레벨 [DATA_NEEDED: MSL classification] —
Logic Elements (LE) — 255,000
Embedded Memory (bits) — 16,672,768
Number of LABs/CLBs — 10,200
User I/Os — 488
Number of Pins / Balls — 780
Maximum Core Frequency — [DATA_NEEDED: maximum core frequency MHz]
Supply Voltage (VCCINT) — [DATA_NEEDED: VCCINT nominal V]
RoHS 상태 — Compliant (lead-free 'N' suffix)
습도 민감도 레벨 (MSL) — [DATA_NEEDED: MSL level per JEDEC J-STD-020]
Configuration Method — SRAM-based, configured via JTAG / passive / active serial / fast passive parallel
Design Toolchain — Altera Quartus II (legacy); Intel Quartus Prime

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