EP3SE260H780C2N vs EP3SE260H780C4N Comparación
Comparación detallada lado a lado de EP3SE260H780C2N por Intel y EP3SE260H780C4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE260H780C2N | EP3SE260H780C4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.600,00 | $1.395,00 |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 255,000 |
| LABs / CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 | 16,672,768 |
| User I/O Count | 488 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Core Voltage | 0.9 V | 0.86 V to 1.15 V |
| Encapsulado | 780-BGA FCBGA | 780-ball FCBGA (Flip Chip BGA) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Rango de temperatura de funcionamiento | Commercial (0C to +85C) | — |
| Speed Grade | C2 | — |
| Nivel MSL | 3 (168 hours) | — |
| Reflow Peak Time Max | 40 s | — |
| Estado RoHS | [DATA_NEEDED: rohs status] | — |
| Lead-Free | [DATA_NEEDED: lead-free] | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Number of Terminals | 780 | — |
| Process Node | 40 nm | 65 nm CMOS |
| Family | — | Stratix III E (Enhanced) |
| Logic Array Blocks (LABs) | — | 10,200 |
| Embedded Memory | — | M9K and M144K blocks |
| User I/O Pins | — | 488 |
| DSP Blocks (18x18 Multipliers) | — | 768 |
| PLLs | — | 12 |
| Maximum Core Clock Frequency | — | 450 MHz |
| Nivel de sensibilidad a la humedad (MSL) | — | 3 (168 hours) |
| Temperatura de funcionamiento | — | 0C to +85C (commercial) |
| Configuration Method | — | Serial/Parallel via Quartus II |