EP3SE260H780C3 vs EP3SE260H780C4LN Comparación
Comparación detallada lado a lado de EP3SE260H780C3 por Intel y EP3SE260H780C4LN por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP3SE260H780C4LN - Stratix III E FPGA 255K LE 780-FCBGA | Intel
EP3SE260H780C4LN ⚠ Última compraComparación de especificaciones
| Parámetro | EP3SE260H780C3 | EP3SE260H780C4LN |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.180,00 | $11.950,00 |
| Device Family | Stratix III Enhanced (Stratix III E) | — |
| Series | EP3SE | — |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10200 | 10,200 |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | 16,672,768 bits (16.67 Mbit) |
| User I/Os | 488 | — |
| Operating Voltage (Core) | 0.9 V | — |
| Operating Voltage (Auxiliary) | 1.1 V | — |
| Process Technology | 65 nm CMOS | — |
| Speed Grade | C3 | C4 (commercial, moderate speed) |
| Temperatura de funcionamiento | Commercial, 0C to +85C | 0C to +85C (commercial) |
| Maximum Core Frequency | 500 MHz | — |
| Encapsulado | 780-ball FCBGA (HBGA), flip-chip | 780-ball FCBGA (FineLine BGA) |
| Tipo de montaje | Surface Mount (BGA) | — |
| Nivel de sensibilidad a la humedad (MSL) | 3 (168 hours) | — |
| Packaging Type | Tray | — |
| Configuration Memory Support | Fast passive parallel, JTAG, Active Serial | — |
| Estado RoHS | Compliant (per product listings) | Compliant |
| Family | — | Stratix III E |
| Embedded Multipliers (18x18) | — | 384 |
| User I/O Count | — | 488 |
| Core Voltage (VCC) | — | 1.0 V |
| I/O Voltage (VCCIO) | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Auxiliary Voltage (VCCPD/VCCPT) | — | 2.5 V / 3.0 V |
| PLLs | — | 8 |
| Global Clock Networks | — | 16 |
| Process Node | — | 40 nm TSMC |
| Configuration Modes | — | FPP, AS, PS, JTAG |
| Nivel MSL | — | 3 (168 hours) |