EP3SE260H780C4N vs EP3SE260H780I4L Comparación
Comparación detallada lado a lado de EP3SE260H780C4N por Intel y EP3SE260H780I4L por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel
EP3SE260H780I4L ⚠ Última compraComparación de especificaciones
| Parámetro | EP3SE260H780C4N | EP3SE260H780I4L |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.395,00 | $1.395,00 |
| Family | Stratix III E (Enhanced) | Stratix III E (Enhanced) |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | — |
| Total RAM Bits | 16,672,768 | — |
| Embedded Memory | M9K and M144K blocks | — |
| User I/O Pins | 488 | — |
| DSP Blocks (18x18 Multipliers) | 768 | — |
| PLLs | 12 | — |
| Process Node | 65 nm CMOS | — |
| Core Voltage | 0.86 V to 1.15 V | 0.9 V |
| Maximum Core Clock Frequency | 450 MHz | — |
| Encapsulado | 780-ball FCBGA (Flip Chip BGA) | — |
| Tipo de montaje | Surface Mount | Surface Mount (flip-chip) |
| Nivel de sensibilidad a la humedad (MSL) | 3 (168 hours) | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | Industrial, -40C to +85C |
| Configuration Method | Serial/Parallel via Quartus II | — |
| Total Memory Bits | — | 16,672,640 |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| User I/O Count | — | 488 |
| Process Technology | — | 65 nm |
| Package Type | — | 780-pin FC-HFBGA (flip-chip BGA) |
| Number of Transceivers | — | 24 (family-level maximum, per-pin count depends on variant) |
| Max Transceiver Data Rate | — | 6.375 Gbps (Stratix III E family spec) |
| Number of 18x18 Multipliers | — | [DATA_NEEDED: per-package multiplier count] |
| Estado RoHS | — | Compliant (lead-free) |
| Configuration Mode | — | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel |
| Pin/Package | — | 780-BBGA, FCBGA (flip-chip) |