EP3SE260H780I4 vs EP3SE260H780C4N Comparación
Comparación detallada lado a lado de EP3SE260H780I4 por Intel y EP3SE260H780C4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE260H780I4 | EP3SE260H780C4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.390,00 | $1.395,00 |
| Family | Stratix III Enhanced (Stratix III E) | Stratix III E (Enhanced) |
| Logic Elements | 255,000 | 255,000 |
| Logic Cells | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Adaptive Logic Modules (ALMs) | approximately 203,200 | — |
| Maximum User I/Os | 488 | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | 0.86 V to 1.15 V |
| Embedded RAM (total) | approximately 14.4 Mbit (M9K/M144K blocks) | — |
| DSP Blocks | approximately 768 (18x18 multipliers) | — |
| Maximum Operating Frequency | up to 450 MHz core / 717 MHz per Partstack record | — |
| Encapsulado | 780-ball FC-HFBGA (HBGA) | 780-ball FCBGA (Flip Chip BGA) |
| Temperatura de funcionamiento | -40C to +100C (industrial, 'I' grade) | 0C to +85C (commercial) |
| Speed Grade | 4 | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Configuration Schemes | JTAG, Passive Serial, Fast Passive Parallel, Active Serial | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | — |
| Total RAM Bits | — | 16,672,768 |
| Embedded Memory | — | M9K and M144K blocks |
| User I/O Pins | — | 488 |
| DSP Blocks (18x18 Multipliers) | — | 768 |
| PLLs | — | 12 |
| Process Node | — | 65 nm CMOS |
| Maximum Core Clock Frequency | — | 450 MHz |
| Nivel de sensibilidad a la humedad (MSL) | — | 3 (168 hours) |
| Configuration Method | — | Serial/Parallel via Quartus II |