EP3SE260H780I4 vs EP3SE260H780I4L Comparación

Comparación detallada lado a lado de EP3SE260H780I4 por Intel y EP3SE260H780I4L por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Comparación de especificaciones

Parámetro EP3SE260H780I4 EP3SE260H780I4L
Marca Intel Intel
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida NRND Última compra
Estado del stock In Stock In Stock
Precio unitario (USD) $1.390,00 $1.395,00
Family Stratix III Enhanced (Stratix III E) Stratix III E (Enhanced)
Logic Elements 255,000 255,000
Logic Cells 255,000 —
Logic Array Blocks (LABs) 10,200 —
Adaptive Logic Modules (ALMs) approximately 203,200 —
Maximum User I/Os 488 —
Process Technology 65 nm CMOS 65 nm
Core Voltage 1.1 V 0.9 V
Embedded RAM (total) approximately 14.4 Mbit (M9K/M144K blocks) —
DSP Blocks approximately 768 (18x18 multipliers) —
Maximum Operating Frequency up to 450 MHz core / 717 MHz per Partstack record —
Encapsulado 780-ball FC-HFBGA (HBGA) —
Temperatura de funcionamiento -40C to +100C (industrial, 'I' grade) Industrial, -40C to +85C
Speed Grade 4 —
Tipo de montaje Surface Mount (BGA) Surface Mount (flip-chip)
Configuration Schemes JTAG, Passive Serial, Fast Passive Parallel, Active Serial —
Estado RoHS [DATA_NEEDED: RoHS compliance status] Compliant (lead-free)
Total Memory Bits — 16,672,640
Number of LABs/CLBs — [DATA_NEEDED: LAB count]
User I/O Count — 488
Package Type — 780-pin FC-HFBGA (flip-chip BGA)
Number of Transceivers — 24 (family-level maximum, per-pin count depends on variant)
Max Transceiver Data Rate — 6.375 Gbps (Stratix III E family spec)
Number of 18x18 Multipliers — [DATA_NEEDED: per-package multiplier count]
Configuration Mode — JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel
Pin/Package — 780-BBGA, FCBGA (flip-chip)

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