EP3SE50F484C3G vs EP3C80F484C8 Comparación
Comparación detallada lado a lado de EP3SE50F484C3G por Intel y EP3C80F484C8 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE50F484C3G | EP3C80F484C8 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $205,00 | $182,76 |
| Family | Stratix III E | Cyclone III |
| Logic Elements | 47,500 | — |
| Adaptive Logic Modules (ALMs) | 19,000 | — |
| Total Embedded Memory | 5,760,000 bits (5.76 Mbit) | — |
| M9K Memory Blocks | 320 (2,304 Kbits) | — |
| M144K Memory Blocks | 12 (1,728 Kbits) | — |
| User I/O Pins | 296 | — |
| 18x18 Multipliers | 384 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 16 | — |
| Encapsulado | 484-ball FCBGA (F484), 1.0 mm pitch | 484-ball FBGA (23x23 mm, 1.0 mm pitch) |
| Speed Grade | C3 | C8 (commercial, slowest Cyclone III grade) |
| Temperatura de funcionamiento | 0C to +85C (commercial, "C") | 0C to +85C (commercial) |
| Process Node | 65 nm TSMC low-power | — |
| Core Voltage | 1.1 V | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant (lead-free) | Compliant |
| Logic Elements (LE) | — | 81,264 |
| Total Memory Bits | — | 2,810,880 bits (2810 Kb) |
| Embedded 18x18 Multipliers | — | 244 |
| Maximum User I/O | — | 295 |
| Process Technology | — | 65 nm CMOS |
| Core Voltage (Vccint) | — | 1.2 V |
| Maximum Operating Frequency | — | 402 MHz |
| Lead-Free | — | Yes |
| Memory Interfaces Supported | — | DDR, DDR2, QDRII SDRAM |