EP3SE50F484C3G vs EP3SE50F484C2 Comparación
Comparación detallada lado a lado de EP3SE50F484C3G por Intel y EP3SE50F484C2 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE50F484C3G | EP3SE50F484C2 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $205,00 | $895,00 |
| Family | Stratix III E | Stratix III Enhanced (Stratix III E) |
| Logic Elements | 47,500 | — |
| Adaptive Logic Modules (ALMs) | 19,000 | — |
| Total Embedded Memory | 5,760,000 bits (5.76 Mbit) | — |
| M9K Memory Blocks | 320 (2,304 Kbits) | — |
| M144K Memory Blocks | 12 (1,728 Kbits) | — |
| User I/O Pins | 296 | 296 |
| 18x18 Multipliers | 384 | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| Encapsulado | 484-ball FCBGA (F484), 1.0 mm pitch | 484-ball FC-FBGA (FCBGA) |
| Speed Grade | C3 | C2 (commercial, fast) |
| Temperatura de funcionamiento | 0C to +85C (commercial, "C") | [DATA_NEEDED: full temp range for C2 suffix] |
| Process Node | 65 nm TSMC low-power | — |
| Core Voltage | 1.1 V | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant (lead-free) | Compliant |
| Logic Elements (LE) | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory (M9K + MLAB) | — | 5,760,000 bits |
| Frecuencia de reloj máxima | — | 600 MHz |
| Process Technology | — | 65 nm |
| Core Supply Voltage | — | 1.1 V |
| Pitch | — | [DATA_NEEDED: ball pitch of FC-FBGA-484] |
| Configuration Interface | — | JTAG / Active Serial (AS) |
| DSP Blocks | — | 18x18 dedicated multipliers |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |