EP3SE50F484C3G vs EP3SL50F484C3G Comparación
Comparación detallada lado a lado de EP3SE50F484C3G por Intel y EP3SL50F484C3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE50F484C3G | EP3SL50F484C3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $205,00 | $165,00 |
| Family | Stratix III E | Stratix III L |
| Logic Elements | 47,500 | — |
| Adaptive Logic Modules (ALMs) | 19,000 | — |
| Total Embedded Memory | 5,760,000 bits (5.76 Mbit) | — |
| M9K Memory Blocks | 320 (2,304 Kbits) | — |
| M144K Memory Blocks | 12 (1,728 Kbits) | — |
| User I/O Pins | 296 | 296 |
| 18x18 Multipliers | 384 | — |
| PLLs | 4 | [DATA_NEEDED: PLL count] |
| Global Clock Networks | 16 | — |
| Encapsulado | 484-ball FCBGA (F484), 1.0 mm pitch | 484-FBGA (FCBGA), 23x23 mm |
| Speed Grade | C3 | C3 |
| Temperatura de funcionamiento | 0C to +85C (commercial, "C") | — |
| Process Node | 65 nm TSMC low-power | 40 nm |
| Core Voltage | 1.1 V | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant (lead-free) | Compliant |
| Logic Elements (LE) | — | 47,500 |
| Embedded Memory Bits | — | 2,184,192 |
| DSP Blocks (18x18 multipliers) | — | 384 |
| Transceivers | — | [DATA_NEEDED: number of embedded transceivers and max data rate] |
| PCIe Hard IP | — | [DATA_NEEDED: PCIe hard IP version] |
| Operating Temperature Grade | — | Commercial (C3 speed grade, 0C to 85C) |
| Supply Voltage Core | — | [DATA_NEEDED: VCC/VCCINT nominal] |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |
| Lead-Free | — | Yes |
| Sin halógenos | — | [DATA_NEEDED: halogen-free status] |