EP3SE50F484C3G vs EP3SL50F484C3G Comparaison
Comparaison détaillée côte à côte de EP3SE50F484C3G par Intel et EP3SL50F484C3G par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3SE50F484C3G | EP3SL50F484C3G |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $205,00 | $165,00 |
| Family | Stratix III E | Stratix III L |
| Logic Elements | 47,500 | — |
| Adaptive Logic Modules (ALMs) | 19,000 | — |
| Total Embedded Memory | 5,760,000 bits (5.76 Mbit) | — |
| M9K Memory Blocks | 320 (2,304 Kbits) | — |
| M144K Memory Blocks | 12 (1,728 Kbits) | — |
| User I/O Pins | 296 | 296 |
| 18x18 Multipliers | 384 | — |
| PLLs | 4 | [DATA_NEEDED: PLL count] |
| Global Clock Networks | 16 | — |
| Boîtier | 484-ball FCBGA (F484), 1.0 mm pitch | 484-FBGA (FCBGA), 23x23 mm |
| Speed Grade | C3 | C3 |
| Température de fonctionnement | 0C to +85C (commercial, "C") | — |
| Process Node | 65 nm TSMC low-power | 40 nm |
| Core Voltage | 1.1 V | — |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Statut RoHS | Compliant (lead-free) | Compliant |
| Logic Elements (LE) | — | 47,500 |
| Embedded Memory Bits | — | 2,184,192 |
| DSP Blocks (18x18 multipliers) | — | 384 |
| Transceivers | — | [DATA_NEEDED: number of embedded transceivers and max data rate] |
| PCIe Hard IP | — | [DATA_NEEDED: PCIe hard IP version] |
| Operating Temperature Grade | — | Commercial (C3 speed grade, 0C to 85C) |
| Supply Voltage Core | — | [DATA_NEEDED: VCC/VCCINT nominal] |
| Niveau MSL | — | [DATA_NEEDED: MSL rating] |
| Lead-Free | — | Yes |
| Sans halogène | — | [DATA_NEEDED: halogen-free status] |