EP3SE50F780C4G vs EP3SE50F780C4N Comparación
Comparación detallada lado a lado de EP3SE50F780C4G por Intel y EP3SE50F780C4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP3SE50F780C4G - Stratix III E FPGA, 47.5K LE, 488 I/O, 780-FBGA | Intel
EP3SE50F780C4G ✓ ActivoComparación de especificaciones
| Parámetro | EP3SE50F780C4G | EP3SE50F780C4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $593,00 | $1.430,00 |
| Family | Stratix III E | Stratix III E |
| Series | Stratix III | — |
| Logic Elements | 47,500 LE | — |
| Adaptive Logic Modules (ALMs) | 19,000 ALM | — |
| Embedded Memory | 5.76 Mbit (5760000 bit) | — |
| Number of I/Os | 488 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count from datasheet] | — |
| Number of Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Process Technology | 40 nm TSMC | — |
| Core Supply Voltage | 1.1 V | — |
| Rango de temperatura de funcionamiento | 0 C to +85 C (commercial) | — |
| Encapsulado | 780-ball FBGA (FCBGA) | 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch |
| Tipo de montaje | Surface Mount (SMD/SMT) | Surface Mount (BGA) |
| Estado RoHS | Compliant | Lead-free / RoHS compliant |
| Lead-Free | Yes | — |
| Nivel MSL | MSL3 (per JEDEC J-STD-020) | 3 (per JEDEC J-STD-020, FBGA package) |
| Configuration Memory | SRAM-based (volatile, requires configuration device) | — |
| Design Software | Quartus II | — |
| Logic Elements (LE) | — | 47,500 |
| Embedded Memory Bits | — | 5,760,000 |
| Embedded Memory (M9K/M144K blocks) | — | 488 (per family datasheet) |
| Number of LABs | — | 1900 |
| Maximum User I/Os | — | 488 |
| DSP Blocks (18x18 multipliers) | — | 432 |
| PLLs | — | 12 (per family datasheet) |
| Maximum Operating Frequency | — | 717 MHz |
| Transceiver Channels | — | Up to 12 (per family, model-dependent) |
| Transceiver Data Rate | — | Up to 6.375 Gbps (per Stratix III E family) |
| Process Node | — | 40 nm |
| Tensión de alimentación | — | Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail) |
| Temperatura de funcionamiento | — | 0C to +85C (C4 commercial grade) |
| Configuration Modes | — | JTAG, Passive Serial, Fast Passive Parallel |
| Hard Memory Controller | — | DDR2/DDR3 SDRAM (per Stratix III E family) |