EP3SE50F780I3G vs EP3SE110F780I4N Comparación
Comparación detallada lado a lado de EP3SE50F780I3G por Intel y EP3SE110F780I4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE50F780I3G | EP3SE110F780I4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.082,02 | $1.850,00 |
| Family | Stratix III E | — |
| Logic Elements (LE) | 47,500 | — |
| Adaptive Logic Modules (ALM) | 19,000 | — |
| Embedded Memory | 8.7 Mbits (M9K + M144K blocks) | — |
| DSP Blocks | 264 (18x18 multipliers) | — |
| Maximum User I/O Pins | 488 | — |
| Transceivers | 12 channels, up to 3.75 Gbps | — |
| Core Voltage | 1.1 V | — |
| Process Technology | TSMC 40 nm | — |
| Encapsulado | 780-pin FC-FBGA (F780) 29x29 mm | 780-ball FCBGA (FineLine BGA) |
| Temperatura de funcionamiento | -40C to +100C (Industrial, I3) | -40C to +100C (industrial) |
| Speed Grade | 3 | 4 |
| Memory Interfaces | DDR3 up to 800 MHz, DDR2, QDR II+ SRAM | — |
| PCI Express Hard IP | Gen1 x1/x4/x8 | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Nivel MSL | 3 | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | — |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix III E |
| Logic Elements | — | 107,500 |
| Embedded Memory Bits | — | 8,936,448 bits |
| Number of LABs/CLBs | — | 4300 |
| Number of Logic Elements / Cells | — | 107500 |
| Number of I/O | — | 488 |
| Package Code (JEDEC) | — | BGA, 780 pins |
| Supply Voltage (VCCINT) | — | [DATA_NEEDED: VCCINT nominal] |
| Process Node | — | 40 nm |
| Lead Free | — | [DATA_NEEDED: lead-free status] |