EP3SE50F780I3G vs EP3SE50F780I3 Comparación
Comparación detallada lado a lado de EP3SE50F780I3G por Intel y EP3SE50F780I3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE50F780I3G | EP3SE50F780I3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.082,02 | $1.245,75 |
| Family | Stratix III E | Stratix III Enhanced (E) |
| Logic Elements (LE) | 47,500 | — |
| Adaptive Logic Modules (ALM) | 19,000 | — |
| Embedded Memory | 8.7 Mbits (M9K + M144K blocks) | — |
| DSP Blocks | 264 (18x18 multipliers) | — |
| Maximum User I/O Pins | 488 | — |
| Transceivers | 12 channels, up to 3.75 Gbps | — |
| Core Voltage | 1.1 V | — |
| Process Technology | TSMC 40 nm | 65 nm |
| Encapsulado | 780-pin FC-FBGA (F780) 29x29 mm | 780-ball FC-FBGA (FineLine BGA) |
| Temperatura de funcionamiento | -40C to +100C (Industrial, I3) | — |
| Speed Grade | 3 | — |
| Memory Interfaces | DDR3 up to 800 MHz, DDR2, QDR II+ SRAM | — |
| PCI Express Hard IP | Gen1 x1/x4/x8 | — |
| Tipo de montaje | Surface Mount (BGA) | — |
| Nivel MSL | 3 | 3 (168 hours) |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Logic Elements | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory (bits) | — | 5,760,000 |
| User I/O Count | — | 488 |
| Internal Frequency (max) | — | 800 MHz |
| Rango de temperatura de funcionamiento | — | -40 C to +100 C (industrial, 'I' grade) |
| Supply Voltage (Core) | — | 0.86 V to 1.13 V (typical 1.1 V) |
| Configuration Mode | — | Passive Serial / Fast Passive Parallel / JTAG |
| PLLs | — | Up to 8 (fractional-N) |
| DSP Multiplier Blocks | — | Yes (per-ALM DSP blocks) |
| Adaptive Logic Modules (ALMs) | — | Yes |