EP3SE50F780I3G vs EP3SE50F780I3 对比
详细并排对比 EP3SE50F780I3G 出自 Intel 和 EP3SE50F780I3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE50F780I3G | EP3SE50F780I3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,082.02 | $1,245.75 |
| Family | Stratix III E | Stratix III Enhanced (E) |
| Logic Elements (LE) | 47,500 | — |
| Adaptive Logic Modules (ALM) | 19,000 | — |
| Embedded Memory | 8.7 Mbits (M9K + M144K blocks) | — |
| DSP Blocks | 264 (18x18 multipliers) | — |
| Maximum User I/O Pins | 488 | — |
| Transceivers | 12 channels, up to 3.75 Gbps | — |
| Core Voltage | 1.1 V | — |
| Process Technology | TSMC 40 nm | 65 nm |
| 封装 | 780-pin FC-FBGA (F780) 29x29 mm | 780-ball FC-FBGA (FineLine BGA) |
| 工作温度 | -40C to +100C (Industrial, I3) | — |
| Speed Grade | 3 | — |
| Memory Interfaces | DDR3 up to 800 MHz, DDR2, QDR II+ SRAM | — |
| PCI Express Hard IP | Gen1 x1/x4/x8 | — |
| 安装类型 | Surface Mount (BGA) | — |
| MSL 等级 | 3 | 3 (168 hours) |
| RoHS 状态 | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Logic Elements | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory (bits) | — | 5,760,000 |
| User I/O Count | — | 488 |
| Internal Frequency (max) | — | 800 MHz |
| 工作温度范围 | — | -40 C to +100 C (industrial, 'I' grade) |
| Supply Voltage (Core) | — | 0.86 V to 1.13 V (typical 1.1 V) |
| Configuration Mode | — | Passive Serial / Fast Passive Parallel / JTAG |
| PLLs | — | Up to 8 (fractional-N) |
| DSP Multiplier Blocks | — | Yes (per-ALM DSP blocks) |
| Adaptive Logic Modules (ALMs) | — | Yes |