EP3SE80F1152C2 vs EP3SE80F1152C3N Comparación
Comparación detallada lado a lado de EP3SE80F1152C2 por Intel y EP3SE80F1152C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE80F1152C2 | EP3SE80F1152C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.325,00 | $1.690,00 |
| Family | Stratix III E | — |
| Logic Elements | 80,000 | — |
| Logic Array Blocks (LABs) | 3,200 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 6,843,392 | — |
| User I/Os | 744 | — |
| Process Technology | 65 nm | 40 nm CMOS |
| Core Voltage (VCCINT) | 1.1 V | — |
| Internal Operating Frequency | up to 600 MHz | — |
| Temperatura de funcionamiento | 0 C to 85 C (Commercial) | 0C to +85C (commercial, C3 grade) |
| Speed Grade | C2 | — |
| Encapsulado | 1152-ball FC-FBGA (Flip Chip FineLine BGA) | — |
| Package Code | F1152 | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | — |
| Series | — | Stratix III E |
| Logic Elements (LEs) | — | 80,000 |
| Total Memory Bits | — | 6,843,392 bits |
| Number of LABs/CLBs | — | 3200 |
| Number of User I/O | — | 744 |
| Número de salidas | — | 744 |
| Encapsulado / Carcasa | — | 1152-BBGA, FCBGA (FineLine BGA) |
| Speed/Power Grade | — | C3 |
| Lead Free | — | Yes |
| Nivel MSL | — | 3 (per JEDEC J-STD-020) |
| Configuration Memory | — | SRAM-based, volatile (needs external config device) |