EP3SL200H780C2N vs EP3SL200H780I3 Comparación
Comparación detallada lado a lado de EP3SL200H780C2N por Intel y EP3SL200H780I3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SL200H780C2N | EP3SL200H780I3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $6.050,00 | $7.980,00 |
| Family | Stratix III L | Stratix III |
| Logic Elements | 200,000 | 200,000 |
| Adaptive Logic Modules (ALMs) | 80,000 | — |
| User I/O Count | 488 | 488 |
| Embedded Memory Bits | 10,901,504 | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Core Voltage | 1.1 V | 1.1 V |
| Maximum Internal Frequency | 800 MHz | — |
| Speed Grade | C2 | — |
| Transceivers | Per family capability - not specified for this OPN | — |
| Encapsulado | 780-ball HBGA / FCBGA | 780-BBGA, FCBGA (HBGA-780) |
| Package Code | PBGA780 / HBGA-780 | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | Commercial (0C to +85C) | -40C to +100C (Industrial) |
| Lead Free | Yes | — |
| Estado RoHS | Compliant | — |
| Series | — | Stratix III L |
| LABs (Logic Array Blocks) | — | 8000 |
| Total RAM Bits | — | 10,901,504 (10,900 Kb) |
| Number of I/O Banks | — | [DATA_NEEDED: I/O banks] |
| Embedded Multipliers (DSP blocks) | — | 384 (18x18) |
| PLLs | — | 12 |
| Maximum Operating Frequency | — | 717 MHz |
| Supplier Device Package | — | 780-FBGA (29x29 mm) |
| Lead-Free / RoHS | — | Compliant (lead-free) |