EP3SL200H780I3 vs EP3SL200H780C3N Comparación
Comparación detallada lado a lado de EP3SL200H780I3 por Intel y EP3SL200H780C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SL200H780I3 | EP3SL200H780C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $7.980,00 | $4.995,00 |
| Series | Stratix III L | — |
| Family | Stratix III | Stratix III L (low-power) |
| Logic Elements | 200,000 | 200,000 |
| LABs (Logic Array Blocks) | 8000 | — |
| Total RAM Bits | 10,901,504 (10,900 Kb) | — |
| User I/O Count | 488 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O banks] | — |
| Embedded Multipliers (DSP blocks) | 384 (18x18) | — |
| PLLs | 12 | 12 (Stratix III PLL array) |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | 717 MHz | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | 0C to +85C (commercial) |
| Encapsulado | 780-BBGA, FCBGA (HBGA-780) | 780-Ball FCBGA (HBGA), 29 x 29 mm |
| Tipo de montaje | Surface Mount | Surface Mount |
| Supplier Device Package | 780-FBGA (29x29 mm) | — |
| Lead-Free / RoHS | Compliant (lead-free) | Yes |
| Process Node | — | 40 nm |
| Embedded Memory Bits | — | 10,901,504 bits |
| Logic Array Blocks (LABs) | — | 8,000 |
| User I/Os | — | 488 |
| Maximum Internal Clock Frequency | — | 800 MHz |
| Transceivers | — | 24 channels, up to 3.75 Gbps |
| DSP Blocks | — | 384 |
| Speed Grade | — | C3 (commercial, -3 speed) |
| Voltage - Core | — | 0.9 V / 1.0 V (core, VCC) |
| Voltage - I/O | — | 1.2 V to 3.3 V (VCCIO banks) |
| Nivel MSL | — | 3 |
| Mounting Pitch | — | 1.0 mm ball pitch |
| Configuration | — | JTAG IEEE Std 1149.1, passive/active serial |