EP3SL200H780I3 vs EP3SL200H780C3N Comparaison
Comparaison détaillée côte à côte de EP3SL200H780I3 par Intel et EP3SL200H780C3N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3SL200H780I3 | EP3SL200H780C3N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $7 980,00 | $4 995,00 |
| Series | Stratix III L | — |
| Family | Stratix III | Stratix III L (low-power) |
| Logic Elements | 200,000 | 200,000 |
| LABs (Logic Array Blocks) | 8000 | — |
| Total RAM Bits | 10,901,504 (10,900 Kb) | — |
| User I/O Count | 488 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O banks] | — |
| Embedded Multipliers (DSP blocks) | 384 (18x18) | — |
| PLLs | 12 | 12 (Stratix III PLL array) |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | 717 MHz | — |
| Température de fonctionnement | -40C to +100C (Industrial) | 0C to +85C (commercial) |
| Boîtier | 780-BBGA, FCBGA (HBGA-780) | 780-Ball FCBGA (HBGA), 29 x 29 mm |
| Type de montage | Surface Mount | Surface Mount |
| Supplier Device Package | 780-FBGA (29x29 mm) | — |
| Lead-Free / RoHS | Compliant (lead-free) | Yes |
| Process Node | — | 40 nm |
| Embedded Memory Bits | — | 10,901,504 bits |
| Logic Array Blocks (LABs) | — | 8,000 |
| User I/Os | — | 488 |
| Maximum Internal Clock Frequency | — | 800 MHz |
| Transceivers | — | 24 channels, up to 3.75 Gbps |
| DSP Blocks | — | 384 |
| Speed Grade | — | C3 (commercial, -3 speed) |
| Voltage - Core | — | 0.9 V / 1.0 V (core, VCC) |
| Voltage - I/O | — | 1.2 V to 3.3 V (VCCIO banks) |
| Niveau MSL | — | 3 |
| Mounting Pitch | — | 1.0 mm ball pitch |
| Configuration | — | JTAG IEEE Std 1149.1, passive/active serial |