EP3SL200H780I3 vs EP3SL200H780C4L Comparación
Comparación detallada lado a lado de EP3SL200H780I3 por Intel y EP3SL200H780C4L por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SL200H780I3 | EP3SL200H780C4L |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $7.980,00 | $6.459,35 |
| Series | Stratix III L | Stratix III |
| Family | Stratix III | — |
| Logic Elements | 200,000 | 200,000 |
| LABs (Logic Array Blocks) | 8000 | — |
| Total RAM Bits | 10,901,504 (10,900 Kb) | — |
| User I/O Count | 488 | 488 |
| Number of I/O Banks | [DATA_NEEDED: I/O banks] | — |
| Embedded Multipliers (DSP blocks) | 384 (18x18) | — |
| PLLs | 12 | — |
| Process Technology | 65 nm CMOS | TSMC 40 nm |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | 717 MHz | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | 0C to 85C (commercial) |
| Encapsulado | 780-BBGA, FCBGA (HBGA-780) | — |
| Tipo de montaje | Surface Mount | — |
| Supplier Device Package | 780-FBGA (29x29 mm) | — |
| Lead-Free / RoHS | Compliant (lead-free) | — |
| Manufacturer | — | Intel (formerly Altera) |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Embedded Memory | — | 6.5 Mbit |
| Package Type | — | 780-ball FCBGA (FineLine BGA, HBGA) |
| Package Code | — | BGA-780 / PBGA780 / HBGA-780 |
| Package Mounting | — | Surface Mount |
| Internal Logic Frequency | — | up to 717 MHz (per ampheo datasheet brief) |
| Speed Grade | — | -4 (medium performance, commercial) |
| Lead-Free / Pb-Free | — | Yes (L suffix, lead-free) |
| Estado RoHS | — | Compliant |
| Configuration Modes | — | FPP, AS, PS, JTAG |