EP3SL200H780I3 vs EP3SL200H780C4L Vergleich
Detaillierter Direktvergleich von EP3SL200H780I3 von Intel und EP3SL200H780C4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SL200H780I3 | EP3SL200H780C4L |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $7.980,00 | $6.459,35 |
| Series | Stratix III L | Stratix III |
| Family | Stratix III | — |
| Logic Elements | 200,000 | 200,000 |
| LABs (Logic Array Blocks) | 8000 | — |
| Total RAM Bits | 10,901,504 (10,900 Kb) | — |
| User I/O Count | 488 | 488 |
| Number of I/O Banks | [DATA_NEEDED: I/O banks] | — |
| Embedded Multipliers (DSP blocks) | 384 (18x18) | — |
| PLLs | 12 | — |
| Process Technology | 65 nm CMOS | TSMC 40 nm |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | 717 MHz | — |
| Betriebstemperatur | -40C to +100C (Industrial) | 0C to 85C (commercial) |
| Gehäuse | 780-BBGA, FCBGA (HBGA-780) | — |
| Montageart | Surface Mount | — |
| Supplier Device Package | 780-FBGA (29x29 mm) | — |
| Lead-Free / RoHS | Compliant (lead-free) | — |
| Manufacturer | — | Intel (formerly Altera) |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Embedded Memory | — | 6.5 Mbit |
| Package Type | — | 780-ball FCBGA (FineLine BGA, HBGA) |
| Package Code | — | BGA-780 / PBGA780 / HBGA-780 |
| Package Mounting | — | Surface Mount |
| Internal Logic Frequency | — | up to 717 MHz (per ampheo datasheet brief) |
| Speed Grade | — | -4 (medium performance, commercial) |
| Lead-Free / Pb-Free | — | Yes (L suffix, lead-free) |
| RoHS-Status | — | Compliant |
| Configuration Modes | — | FPP, AS, PS, JTAG |