EP3SL200H780I4LN vs EP3SL200H780I4 Comparación
Comparación detallada lado a lado de EP3SL200H780I4LN por Altera y EP3SL200H780I4 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SL200H780I4LN | EP3SL200H780I4 |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.280,00 | $6.255,75 |
| Series | Stratix III L | Stratix III L |
| Family | Stratix III L (Low-Power) | Stratix III |
| Manufacturer | Intel / Altera (now Intel PSG) | — |
| Number of Logic Elements / Cells | 200,000 | — |
| Number of LABs / CLBs | 8,000 | — |
| Total RAM Bits | 10,901,504 (approximately 10.9 Mbit) | — |
| Number of I/O | 488 | — |
| Voltage - Supply | 0.9 V core (selectable Vcore) | — |
| Temperatura de funcionamiento | -40C to +100C (industrial) | — |
| Tipo de montaje | Surface Mount | — |
| Encapsulado / Carcasa | 780-BBGA, FCBGA (Flip-Chip BGA) | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Speed Grade | I4 (Industrial, mid-speed grade) | I4 (industrial) |
| Estado RoHS | RoHS Compliant (lead-free) | Compliant |
| Nivel MSL | MSL 3 (168 Hours, per JEDEC J-STD-020) | — |
| Roaming Pin Name Suffix | LN = lead-free, industrial temp, H780 780-ball package | — |
| Logic Elements (LE) | — | 200,000 |
| Logic Array Blocks (LABs) | — | 8000 |
| Embedded Memory Bits | — | 10,901,504 |
| User I/O Count | — | 488 |
| DSP Multipliers (18x18) | — | 384 |
| Voltage - Core Supply | — | 1.1 V |
| Package Type | — | 780-BBGA / FCBGA (FC-HFBGA) |
| Package Dimensions | — | 33 mm x 33 mm |
| Temperatura de unión de funcionamiento | — | -40C to +100C (industrial) |
| Configuration Memory | — | SRAM-based, volatile |
| Design Tool | — | Quartus II (legacy) / Quartus Prime |