EP3SL70F780C3N vs EP3SL70F780C3 Comparación
Comparación detallada lado a lado de EP3SL70F780C3N por Intel y EP3SL70F780C3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SL70F780C3N | EP3SL70F780C3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $198,00 | $780,00 |
| Series | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | — |
| Adaptive Logic Modules (ALMs) | 33,750 | — |
| Embedded Memory Bits | 2,699,264 bits (2.699 Mbit) | — |
| Embedded Multipliers (18x18) | 488 | — |
| Maximum Operating Frequency | 717 MHz | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 1.1 V | — |
| Number of I/O Banks | 8 | [DATA_NEEDED: number of I/O banks] |
| Número de pines | 780 | — |
| Package Type | 780-ball FC-FBGA (29x29 mm) | — |
| Rango de temperatura de funcionamiento | Commercial (0C to +85C) | 0°C to 85°C (commercial) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant (lead-free FBGA) | [DATA_NEEDED: RoHS status] |
| Nivel MSL | 3 (per JEDEC J-STD-020) | — |
| Family | — | Stratix III |
| Logic Elements (LE) | — | 67,500 |
| Embedded Memory (bits) | — | 2,699,264 |
| Logic Array Blocks (LABs) | — | 2,700 |
| User I/O Count | — | 488 |
| Number of Pins / Balls | — | 780 |
| Encapsulado | — | 780-BBGA, FC-FBGA |
| Core Voltage (VCCINT) | — | 1.1 V |
| Maximum Internal Clock Frequency | — | 500 MHz |
| Speed Grade | — | C3 |
| Design Software | — | Quartus II (last supported v13.1) |