EP4CE30F29I8L vs EP4CE22F17I7N Comparación
Comparación detallada lado a lado de EP4CE30F29I8L por Intel y EP4CE22F17I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE30F29I8L | EP4CE22F17I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $41,85 | $43,40 |
| Series | Cyclone IV E | Cyclone IV E |
| Family | Cyclone IV E | — |
| Logic Elements | 28,848 | — |
| Logic Array Blocks (LABs) | 1,803 | — |
| Embedded Memory | 608,256 bits (66,528 bytes / 594 Kbit) | 608,256 bits (594 Kbits) |
| Embedded 18x18 Multipliers | 66 | 66 |
| General Purpose PLLs | 4 | — |
| User I/O Pins | 532 | — |
| I/O Banks | 8 | — |
| Core Voltage (VCCINT) | 1.2 V | 1.2 V (typical); 1.0 V operation supported |
| Auxiliary / I/O Voltages | 2.5 V / 3.0 V / 3.3 V | — |
| Encapsulado | 780-BGA (FBGA-780) | 256-ball FBGA (F17) |
| Temperatura de funcionamiento | -40C to +85C (Industrial) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant (lead-free) | Compliant |
| Configuration Modes | JTAG / Active Serial (AS) / Passive Parallel (PP) | — |
| Process Node | 60 nm low-power | — |
| PCI Express Hard IP | Yes (PIPE Gen1) | — |
| Logic Elements (LE) | — | 22,320 |
| Embedded Memory Blocks | — | 66 M9K blocks |
| Maximum User I/O Pins | — | 153 |
| General-Purpose PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Process Technology | — | 60 nm low-power CMOS |
| Operating Temperature Grade | — | Industrial (-40C to +100C), I7 grade |
| Configuration Mode | — | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) |
| Lead-Free | — | Yes |
| Nivel MSL | — | 3 (per JEDEC J-STD-020) |