EP4CE55F29C7N vs EP4CE55F29C8N Comparación
Comparación detallada lado a lado de EP4CE55F29C7N por Intel y EP4CE55F29C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE55F29C7N | EP4CE55F29C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $138,00 | $285,00 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 55,856 | 55,856 |
| Configurable Logic Blocks (CLBs) | 3,491 | — |
| Total RAM Bits | 2,396,160 | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| User I/O Count | 374 | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Encapsulado | 780-ball FBGA (F29) | 780-ball FBGA (F29) |
| Package Dimensions | 29 mm x 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | — |
| Speed Grade | -7 (C7) | 8 (commercial) |
| Core Voltage | 1.2 V nominal | 1.2 V |
| Tensión de alimentación | 1.2 V | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant (LEAD FREE) | Compliant |
| Lead Free | Yes | — |
| Configuration Mode | JTAG, Active Serial, Passive Parallel | — |
| Embedded Memory | — | 2,340 Kbits |
| Embedded Multiplier Blocks (18x18) | — | 154 |
| Maximum User I/O Pins | — | 374 |
| Logic Array Blocks (LABs) | — | 3,491 |
| Process Technology | — | 60 nm (TSMC low-power) |
| Temperature Grade | — | Commercial (0 C to +85 C) |
| PLLs | — | 4 to 8 (per device) |
| Configuration Method | — | SRAM-based, volatile (requires external config device) |
| Lead-Free / Halogen-Free | — | Yes (per part marking) |