EP4CE55F29C7N vs EP4CE75F23C7 Comparación
Comparación detallada lado a lado de EP4CE55F29C7N por Intel y EP4CE75F23C7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE55F29C7N | EP4CE75F23C7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $138,00 | $148,00 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 55,856 | — |
| Configurable Logic Blocks (CLBs) | 3,491 | — |
| Total RAM Bits | 2,396,160 | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| User I/O Count | 374 | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Encapsulado | 780-ball FBGA (F29) | 484-ball FBGA, 23 x 23 mm, 1.0 mm pitch |
| Package Dimensions | 29 mm x 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | — |
| Speed Grade | -7 (C7) | — |
| Core Voltage | 1.2 V nominal | — |
| Tensión de alimentación | 1.2 V | — |
| Tipo de montaje | Surface Mount | — |
| Estado RoHS | Compliant (LEAD FREE) | Compliant |
| Lead Free | Yes | — |
| Configuration Mode | JTAG, Active Serial, Passive Parallel | — |
| Device Logic Elements | — | 75,408 |
| Logic Array Blocks (LABs) | — | 4,713 |
| Embedded Memory Bits | — | 2,810,880 bits |
| M9K Memory Blocks | — | 305 |
| Embedded 18x18 Multipliers | — | 244 |
| PLLs | — | 4 |
| Maximum User I/O | — | 292 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Process Technology | — | 60 nm low power (TSMC) |
| Operating Temperature Grade | — | Commercial (0C to 85C) |
| Configuration Modes | — | AS, AP, FPP, PS |
| JTAG Support | — | IEEE 1149.1 boundary-scan |
| Maximum Internal Frequency | — | 472.5 MHz |