EP4CE55F29C8L vs EP4CE55F29C7N Comparación
Comparación detallada lado a lado de EP4CE55F29C8L por Intel y EP4CE55F29C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE55F29C8L | EP4CE55F29C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $150,00 | $138,00 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements | 55,856 | — |
| Embedded Memory Bits | 2,396,160 bits | — |
| Embedded Memory (M9K Blocks) | 260 blocks | — |
| Embedded 18x18 Multipliers | 156 | — |
| Maximum User I/O Pins | 374 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.2 V | 1.2 V nominal |
| Process Technology | 60 nm (low-power) | — |
| Encapsulado | 780-ball FBGA (F29), 29x29 mm, 1.0 mm pitch | 780-ball FBGA (F29) |
| Speed Grade | C8 (commercial, 8 speed bin) | -7 (C7) |
| Temperatura de funcionamiento | 0C to +85C (commercial, 'L' suffix) | 0C to +85C (commercial) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant (LEAD FREE) |
| Configuration Schemes | AS, PS, JTAG, FPP | — |
| JTAG (IEEE 1149.1) | Supported | — |
| Configuration Memory | SRAM-based (external flash required) | — |
| Logic Elements (LE) | — | 55,856 |
| Configurable Logic Blocks (CLBs) | — | 3,491 |
| Total RAM Bits | — | 2,396,160 |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| User I/O Count | — | 374 |
| Number of PLLs | — | [DATA_NEEDED: PLL count] |
| Package Dimensions | — | 29 mm x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Tensión de alimentación | — | 1.2 V |
| Lead Free | — | Yes |
| Configuration Mode | — | JTAG, Active Serial, Passive Parallel |