EP4CE55F29I8LN vs EP4CE55F29I7N Comparación
Comparación detallada lado a lado de EP4CE55F29I8LN por Intel y EP4CE55F29I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE55F29I8LN | EP4CE55F29I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $165,00 | $154,80 |
| Family | Cyclone IV E | Cyclone IV E |
| Device Model | EP4CE55 | — |
| Logic Elements (LEs) | 55,856 | — |
| Logic Array Blocks (LABs) | 3,135 | — |
| Total Embedded Memory Bits | 2,396,160 bits | — |
| Embedded Memory (M9K blocks) | 260 blocks | — |
| 18x18 Hardware Multipliers | 374 | — |
| PLLs | 4 | — |
| Maximum User I/O Pins | 374 | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 60 nm TSMC low-power | 60 nm low-k |
| Encapsulado | 780-ball FBGA (F29) | 780-ball FBGA (F29), 29 mm x 29 mm, 1.0 mm pitch |
| Ball Pitch | 1.0 mm | — |
| Temperatura de funcionamiento | -40C to +85C (Industrial) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Yes (per OPN suffix N) | — |
| Configuration Modes | JTAG, AS, PS, FPP | — |
| Supported I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| Logic Elements (LE) | — | 55,856 |
| Embedded Memory Bits | — | 2,396,160 |
| Number of LABs/CLBs | — | 3491 |
| Maximum User I/O | — | 374 |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V (bank-dependent) |
| Number of PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Dedicated Clock Pins | — | 11 |
| Embedded Multipliers (18x18) | — | 154 |
| Speed Grade | — | I7 (industrial) |
| Temperatura de unión de funcionamiento | — | -40 C to +100 C |
| Estado RoHS | — | Compliant |
| Supply Type | — | Tray |