EP4CE75F23I7N vs EP4CGX110CF23I7 Comparación
Comparación detallada lado a lado de EP4CE75F23I7N por Intel y EP4CGX110CF23I7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE75F23I7N | EP4CGX110CF23I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $118,00 | $338,55 |
| Product Line | Cyclone IV E | — |
| Family | Cyclone IV E (EP4CE) | Cyclone IV GX |
| Logic Elements (LEs) | 75,408 | — |
| Logic Array Blocks (LABs) | 4,713 | — |
| Embedded Memory Bits | 2,810,880 bits (312 M9K blocks) | 5,621,760 bits |
| Distributed RAM Bits | 200 Kbits | — |
| Embedded 18x18 Multipliers | 15 | 66 |
| PLLs | 4 | 8 |
| Global Clocks | [DATA_NEEDED: global clock network count] | — |
| Maximum User I/Os | 292 | — |
| Core Voltage (VCCINT) | 1.2 V nominal | 1.2 V |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) | — |
| Process Technology | 60 nm low-power CMOS | 60 nm low-power |
| Encapsulado | 484-ball FBGA (F23, 23 mm body, 1.0 mm pitch) | 484-pin FBGA (F23) |
| Operating Temperature Grade | Industrial (I7: -40C to +100C Tj) | — |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG | — |
| External Memory Interfaces | DDR / DDR2 SDRAM, QDRII SRAM | — |
| Design Software | Quartus II / Quartus Prime | — |
| Estado RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 109,424 |
| Logic Array Blocks (LAB) | — | [DATA_NEEDED: LAB count] |
| M9K Memory Blocks | — | [DATA_NEEDED: M9K block count] |
| User I/O | — | 270 |
| Transceivers | — | 8 channels up to 3.125 Gbps |
| Temperatura de funcionamiento | — | -40C to +100C (industrial) |
| Lead-Free | — | Yes |