EP4CE75F29C8L vs EP4CE75F29C8 Comparación
Comparación detallada lado a lado de EP4CE75F29C8L por Intel y EP4CE75F29C8 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE75F29C8L | EP4CE75F29C8 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $109,80 | $121,42 |
| Family | Cyclone IV E | — |
| Device Type | FPGA (Field-Programmable Gate Array) | — |
| Logic Elements (LE) | 75,408 | 75,408 |
| Configurable Logic Blocks (CLBs) | 4,713 | — |
| Embedded Memory | 2,810,880 bits (426 Kbits M9K blocks) | — |
| Embedded Multipliers (18x18) | 426 | 274 |
| General-Purpose I/O Pins | 426 (max) | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Process Technology | 60 nm low-power CMOS | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Analog Voltage (VCCA) | 2.5 V | — |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Speed Grade | C8 (commercial, 8 speed bin) | -8 |
| Temperatura de funcionamiento | 0C to 85C (commercial) | 0C to +85C (commercial) |
| Encapsulado | FBGA-780 (FineLine BGA, 29x29 mm, 1.0 mm pitch) | 780-ball FineLine BGA (FBGA-780) |
| Ball Count | 780 | — |
| Tipo de montaje | Surface Mount | — |
| Estado RoHS | Compliant (lead-free) | Compliant |
| Configuration Scheme | AS, PS, JTAG, FPP | — |
| Series | — | Cyclone IV E |
| Total Memory Bits | — | 2,810,880 bits |
| Embedded Memory (M9K blocks) | — | 245 |
| User I/O Pins | — | 426 |
| Core Voltage | — | 1.2 V |
| Process Node | — | 60 nm low-power |
| Configuration Modes | — | AS, PS, JTAG, FPP |
| I/O Standards | — | LVDS, LVCMOS, LVTTL, SSTL |