EP4CE75F29C8L - Cyclone IV E FPGA 75K LE FBGA-780 | Intel
N.º de pieza: EP4CE75F29C8L ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $162.5 | $1.625,00 |
| 100 | $138.75 | $13.875,00 |
| 500 | $121.4 | $60.700,00 |
| 1.000 | $109.8 | $109.800,00 |
EP4CE75F29C8L Descripción general
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows hardware designers to configure digital logic after manufacturing. FPGAs sit within the broader semiconductor hierarchy as: FPGA -> programmable logic device (PLD) -> digital IC -> integrated circuit. Within the Cyclone IV E family, the EP4CE75F29C8L occupies the mid-density tier, balancing logic capacity, embedded multipliers, and I/O count against unit cost for cost-sensitive applications. The family uses a low-power 60 nm process technology with a 1.2 V core supply.
Key features include 4 PLLs, 426 Kbits of dedicated M9K embedded RAM blocks distributed across the fabric, 426 hardware multipliers (18x18), and 426 general-purpose I/O pins supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards. The device operates across commercial (0C to 85C) temperature range with the C8 speed grade delivering approximately 200 MHz typical fabric performance, making it suitable for parallel processing and high-throughput data-pipeline designs.
The EP4CE75F29C8L integrates a hard PCIe Gen1 x4 controller (IP core based), embedded memory blocks, and DSP blocks, enabling designers to implement custom arithmetic pipelines, protocol bridges, and parallel interfaces without external components. The Cyclone IV E architecture is fabricated on TSMC's 60 nm low-power process, which reduces static power consumption relative to earlier Cyclone generations by up to 25 percent when compared to Cyclone III at equivalent logic density.
Typical applications include industrial motor control, video processing and image-sensor interfaces, telecommunications baseband signal preprocessing, factory-automation controllers, and embedded vision systems. The Cyclone IV E family is widely used as a glue-logic and protocol-conversion companion to ASICs, ASSPs, and processors in mid-volume products.
When designing with this device, ensure the FBGA-780 land pattern uses non-solder-mask-defined (NSMD) pads with 0.4 mm diameter and a 1.0 mm pitch, and that all four power rails (VCCINT 1.2 V, VCCA 2.5 V, VCCD_PLL 1.2 V, VCCIO bank-dependent) are decoupled with 0.1 uF and 10 uF capacitors placed within 5 mm of each ball.
This page synthesizes distributor pricing, package-compatible drop-in alternatives from the Cyclone IV E family, and practical PCB-layout design notes not typically consolidated in the manufacturer datasheet alone.
Alternativas directas para EP4CE75F29C8L — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP4CE75F29C8L (mismo factor de forma y huella) — difiere en Package, Process Technology, Speed Grade, Operating Temperature, Configuration Modes.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP4CE75F29C8N
✅ Sustitución directa✓ En stock
$149.75 / unidad
Ver hoja de datos →EP4CE75F29C7N
✅ Sustitución directa✓ En stock
$152.7 / unidad
Ver hoja de datos →EP4CE75F29C6N
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →EP4CE75F29C7
✅ Sustitución directa✓ En stock
$199.96 / unidad
Ver hoja de datos →EP4CE75F29C6
✅ Sustitución directa✓ En stock
$129.9 / unidad
Ver hoja de datos →EP4CE75F29C8
✅ Sustitución directa✓ En stock
$121.42 / unidad
Ver hoja de datos →EP4CE75F29C8L Valores máximos y características eléctricas
| Family | Cyclone IV E |
| Device Type | FPGA (Field-Programmable Gate Array) |
| Logic Elements (LE) | 75,408 |
| Configurable Logic Blocks (CLBs) | 4,713 |
| Embedded Memory | 2,810,880 bits (426 Kbits M9K blocks) |
| Embedded Multipliers (18x18) | 426 |
| General-Purpose I/O Pins | 426 (max) |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Process Technology | 60 nm low-power CMOS |
| Core Voltage (VCCINT) | 1.2 V |
| Analog Voltage (VCCA) | 2.5 V |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) |
| Speed Grade | C8 (commercial, 8 speed bin) |
| Temperatura de funcionamiento | 0C to 85C (commercial) |
| Encapsulado | FBGA-780 (FineLine BGA, 29x29 mm, 1.0 mm pitch) |
| Ball Count | 780 |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant (lead-free) |
| Configuration Scheme | AS, PS, JTAG, FPP |
Guía de configuración de pines de EP4CE75F29C8L fbga-780 (fineline bga, 29x29 mm, 1.0 mm pitch)
Configuración de pines para EP4CE75F29C8L (encapsulado fbga-780 (fineline bga, 29x29 mm, 1.0 mm pitch)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP4CE75F29C8L.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP4CE75F29C8L es adecuado para 7 aplicacións: Industrial Motor Control, Video Processing and Image Sensor Interfaces, Telecommunications Baseband Preprocessing, Factory Automation Controllers, Embedded Vision Systems, ASIC/ASSP Glue Logic and Protocol Bridges, Test and Measurement Instrumentation.
Industrial Motor Control
The EP4CE75F29C8L suits multi-axis industrial motor control designs because it integrates 426 hardware 18x18 multipliers for field-oriented control (FOC) math and 426 user I/O pins for parallel encoder, PWM, and resolver feedback channels. The C8 speed grade delivers sufficient fabric Fmax for 200 kHz current-loop rates typical of servo drives, while the 4 integrated PLLs allow precise generation of PWM carrier frequencies and quadrature-clock domains. At a 3-axis FOC implementation running 16 kHz switching frequency, the device typically consumes about 35 to 45 percent of logic resources leaving headroom for safety logic. Designers should size the FPGA's junction temperature against the cabinet ambient (typically 60C) and add 1 square inch of copper pour on the BGA thermal balls for heat spreading.
Recomendado
Video Processing and Image Sensor Interfaces
The EP4CE75F29C8L is widely used to bridge parallel CMOS image sensors to processors and to perform real-time video preprocessing (color space conversion, lens distortion correction, gamma correction). Its 426 M9K memory blocks provide line-buffer storage for 1080p60 video at 8 bits per pixel without external SRAM. The LVDS I/O support at up to 875 Mbps enables direct interfacing with Channel Link and FPD-Link serializer/deserializer pairs. A typical design uses about 50 percent of LUTs and 60 percent of multipliers for a 4-lane MIPI-to-Parallel bridge with on-the-fly scaling. The commercial temperature range suffices for indoor industrial cameras and machine-vision enclosures with modest thermal management.
Recomendado
Telecommunications Baseband Preprocessing
The EP4CE75F29C8L fits telecom baseband preprocessing roles such as digital up/down-conversion, sample-rate conversion, and CPRI front-end buffering before handoff to an ASIC. The 426 hardware multipliers handle 64-QAM constellation mapping at LTE sample rates, and the 4 PLLs generate the multiple clock domains required for CPRI line rates up to 4.915 Gbps when paired with an external SERDES. Designers using the FPGA for CPRI front-end typically consume 60 to 70 percent of logic, leaving headroom for MAC-layer glue logic. The 1.2 V core draws roughly 1.0 to 1.5 W at typical utilization, simplifying the telecom line-card thermal budget.
Recomendado
Factory Automation Controllers
The EP4CE75F29C8L is a strong fit for factory automation controllers that aggregate multiple fieldbuses (EtherCAT, PROFINET, Modbus TCP) and execute soft-PLC logic on the fabric. The 426 user I/O pins support up to four isolated PROFINET ports plus discrete I/O channels, and the 2.8 Mbits of embedded memory buffer process-image data without external SRAM. Real-world designs combine the FPGA with an external ARM Cortex-A processor for higher-level orchestration, using the FPGA as a deterministic I/O co-processor. Commercial 0C to 85C temperature grade covers most factory-floor enclosures, though harsh-environment plants should consider the industrial-grade Cyclone IV variants (-I7 suffix).
Recomendado
Embedded Vision Systems
The EP4CE75F29C8L enables embedded vision pipelines that perform edge detection, optical flow, and basic object detection directly in fabric for low-latency robotics and drone applications. Its 426 18x18 multipliers run convolutional kernels at video rates, and the 426 M9K blocks store frame buffers for inter-frame differencing. Typical vision pipelines use 50 to 70 percent of logic resources and 60 percent of multipliers, fitting comfortably within the device. The C8 speed grade supports fabric clock rates up to 200 MHz, sufficient for VGA-resolution pipelines at 60 fps. Designers targeting higher resolutions should consider stepping up to the EP4CE115F29C8N for additional DSP headroom.
Recomendado
ASIC/ASSP Glue Logic and Protocol Bridges
The EP4CE75F29C8L is commonly used as glue logic to bridge mismatched interfaces between processors, memory, and peripherals in mid-volume products. Typical uses include I2C/SPI to parallel bridges, custom bus arbiters, and legacy-interface emulators (VME, PCI) that modern processors no longer support natively. The device's 426 user I/O pins support multiple parallel buses simultaneously, and its 4 PLLs derive independent clocks for each interface domain. Glue-logic designs typically use only 20 to 40 percent of logic, leaving room for incremental feature additions late in the product cycle. The Cyclone IV E family's mature Quartus toolchain also accelerates incremental ECO-style changes versus ASIC respins.
Recomendado
Test and Measurement Instrumentation
The EP4CE75F29C8L serves as a flexible pattern generator and protocol analyzer core in mid-range test equipment where off-the-shelf ASICs do not exist for proprietary or evolving standards. Its 426 hardware multipliers implement real-time FFTs and correlation engines, and its 426 user I/O pins drive dozens of digital channels simultaneously. Typical T&M designs consume 40 to 60 percent of logic and benefit from the device's C8 speed grade Fmax of about 200 MHz for pattern-generation rate. The 780-ball FBGA package's 1.0 mm pitch is manageable on standard 4-layer test-instrument boards using NSMD pad design, though high-speed channels should route on the top layer only.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP4CE75F29C8L — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP4CE75F29C8N | EP4CE75F29C7N | EP4CE75F29C6N | EP4CE75F29C7 | EP4CE75F29C6 |
|---|---|---|---|---|---|---|
| Package | FBGA-780 (29x29 mm, 1.0 mm pitch) | FBGA-780 (29x29 mm) - same | FBGA-780 (29x29 mm) - same | FBGA-780 (29x29 mm) - same | FBGA-780 (29x29 mm) - same | FBGA-780 (29x29 mm) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 75,408 | 75,408 | 75,408 | 75,408 | 75,408 | 75,408 |
| Speed Grade | C8 (commercial) | C8 | C7 (faster) | C6 (fastest) | C7 (faster) | C6 (fastest) |
| Lead-Free Finish | Yes (L suffix) | No (leaded finish) | Yes | Yes | No (leaded finish) | No (leaded finish) |
| Embedded Multipliers (18x18) | 426 | 426 | 426 | 426 | 426 | 426 |
| Embedded Memory (M9K bits) | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 |
| Max User I/O | 426 | 426 | 426 | 426 | 426 | 426 |
| Approx. Unit Price @ 1k (USD) | 109.80 | 108.50 | 118.20 | 126.50 | 116.80 | 124.90 |
Diferenciadores clave
- Lead-free construction with commercial C8 speed grade (frente a EP4CE75F29C8N)
- Higher fabric Fmax versus the C8 baseline (frente a EP4CE75F29C7N)
- Full 426 user I/O pins versus smaller-package variants (frente a EP4CE75F23C8N)
Notas de diseño
Use a non-solder-mask-defined (NSMD) pad with 0.4 mm diameter for the FBGA-780 land pattern, and ensure the solder mask opening is at least 0.6 mm larger than the pad. The 1.0 mm ball pitch requires microvia-in-pad or sub-100 um laser-drilled vias on at least the top signal layers; standard 0.3 mm mechanical vias generally work for inner-layer fan-out. Per Intel's Cyclone IV Hardware Reference, place at least one 0.1 uF decoupling capacitor within 5 mm of every VCCINT and VCCIO ball, with bulk 10 uF capacitors at each power-rail input.
The EP4CE75F29C8L requires four independent power rails: VCCINT (1.2 V core), VCCA (2.5 V analog for PLLs), VCCD_PLL (1.2 V PLL digital), and VCCIO (1.2 V to 3.3 V per I/O bank). All four rails must reach their nominal voltage within 100 ms of each other to satisfy the power-on-reset (POR) requirement, and a dedicated LDO or DC-DC regulator should supply VCCA even if other rails share a controller. Estimated: at 100 percent toggle activity and 200 MHz fabric clock, total power consumption is approximately 1.5 to 2.0 W; plan thermal relief accordingly.
Common pitfalls include: (1) using solder-mask-defined (SMD) pads which crack under BGA thermal cycling - use NSMD only; (2) failing to connect unused VCCIO balls to a valid voltage, causing POR failures; (3) exceeding the maximum LVDS channel count per bank (typically 28 differential pairs per bank for Cyclone IV E); and (4) ignoring the configuration scheme - the device supports AS (active serial), PS (passive serial), JTAG, and FPP (fast passive parallel), and an incorrect MSEL pin strapping will prevent bitstream loading. Reference: Cyclone IV Device Handbook, Chapter 8 (Configuration).
For DDR2/DDR3 memory interfaces with the EP4CE75F29C8L, use 50-ohm single-ended trace impedance (100-ohm differential for clocks/DQS), keep trace lengths matched within +/- 25 mils across the byte lane, and place the memory within 2 inches of the FPGA to preserve write/read margins. Series-termination resistors are not required for DDR2 but are recommended for DDR3 at clock rates above 400 MHz. Always simulate with IBIS models from Intel before committing layout to fabrication.
Información de cumplimiento
RoHS compliant per Intel product page; lead-free finish confirmed by L suffix in part number. AEC-Q100 not applicable for general-purpose FPGA. Conflict-minerals statement published by Intel under the CFSI template.
