EP4CGX150DF27I7 vs EP4CGX150DF27C6N Comparación
Comparación detallada lado a lado de EP4CGX150DF27I7 por Intel y EP4CGX150DF27C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP4CGX150DF27C6N - 149760 Cells, 3.125 Gbps Transceiver FPGA | Intel
EP4CGX150DF27C6N ✓ ActivoComparación de especificaciones
| Parámetro | EP4CGX150DF27I7 | EP4CGX150DF27C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $460,00 | $205,00 |
| Device Family | Cyclone IV GX | — |
| Logic Elements (LEs) | 149,760 | — |
| Embedded Memory Bits | 6,635,520 (M9K blocks) | — |
| Embedded Multipliers (18x18) | 720 | [DATA_NEEDED: 18x18 multiplier count] |
| User I/O Count | 393 | — |
| Transceivers | Up to 8 channels, 3.125 Gbps | 8 high-speed serial channels up to 3.125 Gbps |
| Hard Memory Controller | Yes | — |
| Hard PCI Express | Yes (x1 / x2 Gen1) | — |
| Process Technology | 60 nm low-power | 60 nm |
| Core Supply Voltage | 1.2 V | 1.2 V (range 1.16 V to 1.24 V) |
| Encapsulado | 672-ball FBGA (F27, 1.0 mm pitch) | 672-ball FBGA (F27) |
| Temperatura de unión de funcionamiento | -40 °C to +100 °C (industrial) | — |
| Speed Grade | 7 | C6 (commercial) |
| Configuration Scheme | Active serial / passive serial / JTAG | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Family | — | Cyclone IV GX |
| Logic Elements | — | 149,760 |
| Total Memory Bits | — | [DATA_NEEDED: total memory bits] |
| User I/O Pins | — | [DATA_NEEDED: user I/O count for F27 package] |
| Logic Array Blocks (LABs) | — | [DATA_NEEDED: LAB count] |
| PCIe Hard IP | — | Yes, Gen1 x1/x2/x4 |
| Temperatura de funcionamiento | — | Commercial (0C to +85C) |
| Tipo de montaje | — | Surface Mount (BGA) |
| Pin/Ball Count | — | 672 |