EP4CGX30BF14C7 vs EP4CGX30BF14C8 Comparación
Comparación detallada lado a lado de EP4CGX30BF14C7 por Intel y EP4CGX30BF14C8 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX30BF14C7 | EP4CGX30BF14C8 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $18,10 | $46,80 |
| Series | Cyclone® IV GX | — |
| Family | Cyclone IV GX | Cyclone IV GX |
| Device Logic Elements | 29,440 | — |
| Total Memory Bits | 1,105,920 bits | — |
| Embedded Multipliers (18x18) | 66 | 80 |
| PLLs | [DATA_NEEDED: PLL count] | 4 |
| Transceivers | Up to 4 channels, 3.125 Gbps | Integrated (GX series, up to 3.125 Gbps) |
| User I/O Pins | 72 | — |
| Encapsulado | 169-ball FBGA (F14) | 169-LBGA (FBGA) |
| Package Code | LBGA-169 | — |
| Temperatura de funcionamiento | 0C to +85C (Commercial) | 0C to +70C (Commercial) |
| Speed Grade | C7 | 8 |
| Core Voltage | 1.2 V | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Estado RoHS | Compliant (per distributor listings) | Compliant |
| Logic Elements | — | 29,440 LE |
| Embedded Memory | — | 1,105,920 bits (108 M9K blocks) |
| Maximum User I/Os | — | 72 |
| Core Supply Voltage | — | 1.2 V |
| Global Clock Networks | — | 20 |
| Configuration Method | — | JTAG, Passive Serial, EPCS |
| Lead-Free | — | Yes |
| Number of Terminals | — | 169 |
| Package Shape | — | Square (BGA) |
| Terminal Form | — | Ball |