EP4CGX50DF23I8N vs EP4CGX50CF23I7N Comparación
Comparación detallada lado a lado de EP4CGX50DF23I8N por Intel y EP4CGX50CF23I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX50DF23I8N | EP4CGX50CF23I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $60,00 | $121,40 |
| Family | Cyclone IV GX | — |
| Logic Elements | 49,888 | — |
| Process Technology | 60 nm | — |
| Core Voltage | 1.2 V | — |
| Encapsulado | 484-ball FineLine BGA (FBGA) | 484-ball FBGA (F23), 23 x 23 mm, 1.0 mm pitch |
| Package Code | F23 | — |
| Temperatura de funcionamiento | -40C to +85C (Industrial) | -40C to +100C (industrial, I7) |
| Temperature Grade | I8N (Industrial, Pb-free) | — |
| User I/O (max) | 364 | — |
| Embedded RAM | 234 Kbits (M9K blocks) | — |
| PLLs | 2 | — |
| Transceivers | Up to 8 (3.125 Gbps) | 8 channels, up to 3.125 Gbps |
| PCIe Hard IP | Yes (Gen1/Gen2) | — |
| Multipliers | 18x18 dedicated DSP blocks | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Estado RoHS | Compliant (Pb-free) | Compliant (lead-free N suffix) |
| Device Family | — | Cyclone IV GX |
| Logic Elements (LE) | — | 49,888 |
| Configurable Logic Blocks (CLBs) | — | 3,118 |
| Embedded Memory Bits | — | 2,562,048 |
| Maximum User I/O | — | 290 |
| Core Supply Voltage | — | 1.2 V |
| Configuration Modes | — | AS, PS, JTAG |
| Design Toolchain | — | Quartus II / Quartus Prime |
| Process Node | — | 60 nm (Cyclone IV family) |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |