EP4CGX50DF27I7 vs EP4CGX50DF27C7N Comparación
Comparación detallada lado a lado de EP4CGX50DF27I7 por Intel y EP4CGX50DF27C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX50DF27I7 | EP4CGX50DF27C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $99,00 | $58,60 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 LE | — |
| Embedded Memory | 2,562,048 bits (2.44 Mbit) / 250 M9K blocks of 9 Kbit | — |
| Number of LABs/CLBs | 3,118 | — |
| Embedded 18x18 Multipliers | 56 | — |
| User I/Os | 310 | — |
| Number of Transceivers | 8 (up to 3.125 Gbps) | — |
| PCIe Hard IP | 1 Gen1 controller (x1/x2/x4) | — |
| Process Technology | 60 nm | — |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Temperatura de funcionamiento | -40 C to +100 C (industrial I7 grade) | — |
| Encapsulado | 672-ball FBGA (F27, 27x27 mm, 1.0 mm pitch) | 672-pin FBGA (FineLine BGA) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Configuration Method | SRAM-based, JTAG/AS/PS | — |
| Estado RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 49,888 |
| Logic Array Blocks (LAB) | — | [DATA_NEEDED: LAB count for EP4CGX50] |
| Total Embedded Memory Bits | — | 2,562,048 |
| User I/O Pins (max) | — | 310 |
| Transceivers | — | Yes (3.125 Gbps GX channels, package-dependent) |
| Process Node | — | 60 nm |
| Operating Temperature (Commercial 'C') | — | 0C to +85C |
| PLL Count | — | 6 |
| Hard Memory Controller | — | DDR/DDR2/DDR3/QDRII/RLDRAM PHY |
| Lead-Free | — | Yes |