EP4CGX75CF23I8N vs EP4CGX75CF23I7N Comparación
Comparación detallada lado a lado de EP4CGX75CF23I8N por Intel y EP4CGX75CF23I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX75CF23I8N | EP4CGX75CF23I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $102,40 | $165,30 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 73,920 | 73,920 |
| Embedded Memory Bits | 4,257,792 | — |
| Embedded Memory Type | M9K blocks | — |
| Embedded Multipliers (18x18) | 198 | 150 |
| Maximum User I/O Pins | 290 | — |
| Transceivers | 8 channels up to 3.125 Gbps | 8 channels up to 3.125 Gbps |
| PCIe Hard IP | 1 hard PCIe Gen1 block (x1/x2/x4) | — |
| PLLs | 4 | 8 |
| DLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Process Technology | 60 nm | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Encapsulado | 484-ball FBGA | 484-FBGA (F23), 23 x 23 mm, 1.0 mm pitch |
| Package Code | F23 | — |
| Speed Grade | 8 (commercial fast) | — |
| Temperatura de unión de funcionamiento | -40C to +100C (industrial) | — |
| Estado RoHS | Compliant | Lead-free (compliant per datasheet.com excerpt) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (FBGA) |
| Nivel MSL | 3 | 3 (per typical Altera FBGA) |
| Series | — | EP4CGX75 (F23) |
| Configurable Logic Blocks (CLBs) | — | 4,620 |
| Embedded Memory | — | 4,257,792 bits (316 M9K blocks) |
| User I/O Pins | — | 290 |
| Temperatura de funcionamiento | — | -40C to +100C (industrial I7 grade) |
| Process Node | — | 60 nm low-power |
| Configuration Modes | — | Active Serial, Passive Serial, JTAG, Fast Passive Parallel |