EP4CGX75DF27C8N vs EP4CGX75DF27C7 Comparación
Comparación detallada lado a lado de EP4CGX75DF27C8N por Intel y EP4CGX75DF27C7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX75DF27C8N | EP4CGX75DF27C7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $117,11 | $86,80 |
| Device Family | Cyclone IV GX | — |
| Logic Elements (LE) | 73,920 | — |
| Logic Array Blocks (LAB) | 4,605 | — |
| Embedded Memory | 4,257,792 bits (approx. 532 Kbits RAM) | — |
| Embedded 18x18 Multipliers | 274 | — |
| User I/O Pins | 310 | — |
| High-Speed Transceivers | Up to 8 channels, 3.125 Gbps | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 60 nm low-power CMOS | — |
| Encapsulado | 672-ball FBGA (F27) | 672-ball FBGA |
| Operating Temperature (Commercial) | 0C to +85C | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Configuration Method | SRAM-based, requires external config device | — |
| PCIe Hard IP | PCIe Gen1 x1/x2/x4 endpoint | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free / Halogen-Free | Yes / [DATA_NEEDED: halogen free status] | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Series | — | Cyclone IV GX |
| Logic Cells | — | 73,920 |
| Configurable Logic Blocks | — | 4,620 |
| User I/O | — | 310 |
| Configuration-related Bits | — | 4,257,792 |
| Tensión de alimentación | — | 1.2 V |
| Package Body | — | 27 mm x 27 mm |
| Ball Pitch | — | 1 mm |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| REACH Status | — | [DATA_NEEDED: REACH status] |