EP4SGX360FF35C2X vs EP4SGX360FF35C2XN Comparación
Comparación detallada lado a lado de EP4SGX360FF35C2X por Intel y EP4SGX360FF35C2XN por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX360FF35C2X | EP4SGX360FF35C2XN |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.450,00 | $2.600,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353,600 | 353,600 |
| Adaptive Logic Modules (LABs) | 14,144 | — |
| Embedded Memory | 23,105,536 bits | — |
| User I/O Pins | 564 | — |
| Number of Transceivers | 24 | 24 |
| Max Transceiver Data Rate | 8.5 Gbps | — |
| DSP Blocks (18x18 multipliers) | 1,288 | — |
| Global Clock Networks | 32 | — |
| Process Node | 40 nm CMOS | — |
| Encapsulado | 1152-ball FCBGA (FF35), 35 x 35 mm, 1.0 mm pitch | 1152-BBGA, FCBGA (Flip-Chip BGA) |
| Speed Grade | C2 (fastest) | -2 |
| Temperatura de unión de funcionamiento | 0 °C to +85 °C (commercial) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Design Software | Quartus II | — |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| LABs/CLBs | — | 14,144 |
| Embedded Memory (bits) | — | 23,105,536 |
| Number of Logic Elements/Cells | — | 353,600 |
| Total RAM Bits | — | 23,105,536 |
| Number of I/O | — | 564 |
| User I/O Banks | — | 12 |
| Supply Voltage - Core | — | 0.9 V |
| Transceiver Data Rate (max) | — | 8.5 Gbps |
| DSP Multipliers (18x18) | — | 1,920 (estimated per family datasheet) |
| Process Technology | — | 40 nm TSMC |
| Temperatura de funcionamiento | — | 0C to +85C (Commercial) |