EP4SGX360FF35C2XN vs EP4SGX360FF35C4N Comparación
Comparación detallada lado a lado de EP4SGX360FF35C2XN por Intel y EP4SGX360FF35C4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX360FF35C2XN | EP4SGX360FF35C4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.600,00 | $3.550,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353,600 | 353,600 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | 141,440 (Mouser reports 14,144 LABs) |
| LABs/CLBs | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | — |
| Number of Logic Elements/Cells | 353,600 | — |
| Total RAM Bits | 23,105,536 | — |
| Number of I/O | 564 | — |
| User I/O Banks | 12 | — |
| Supply Voltage - Core | 0.9 V | — |
| Speed Grade | -2 | — |
| Number of Transceivers | 24 | — |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| DSP Multipliers (18x18) | 1,920 (estimated per family datasheet) | — |
| Process Technology | 40 nm TSMC | 40 nm |
| Encapsulado | 1152-BBGA, FCBGA (Flip-Chip BGA) | 1152-ball FC-BGA (FF35) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Temperatura de funcionamiento | 0C to +85C (Commercial) | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | [DATA_NEEDED: lead-free status] |
| Memory Bits | — | 23,105,536 bits (~22 Mbit) |
| Maximum User I/Os | — | 564 |
| Number of LABs/CLBs | — | 14144 |
| Transceivers | — | [DATA_NEEDED: transceiver count and data rate] |
| Core Voltage | — | 0.9 V |
| Operating Temperature Grade | — | Commercial (C4) |
| Series | — | Stratix IV GX |
| Part Status | — | Obsolete (per Micropcba / distributor listings) |