EP4SGX360FF35C2XN vs EP4SGX360FF35C4N 비교
다음의 상세 나란히 비교: EP4SGX360FF35C2XN 제조: Intel 및 EP4SGX360FF35C4N 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP4SGX360FF35C2XN | EP4SGX360FF35C4N |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | Obsolete |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $2,600.00 | $3,550.00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353,600 | 353,600 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | 141,440 (Mouser reports 14,144 LABs) |
| LABs/CLBs | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | — |
| Number of Logic Elements/Cells | 353,600 | — |
| Total RAM Bits | 23,105,536 | — |
| Number of I/O | 564 | — |
| User I/O Banks | 12 | — |
| Supply Voltage - Core | 0.9 V | — |
| Speed Grade | -2 | — |
| Number of Transceivers | 24 | — |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| DSP Multipliers (18x18) | 1,920 (estimated per family datasheet) | — |
| Process Technology | 40 nm TSMC | 40 nm |
| 패키지 | 1152-BBGA, FCBGA (Flip-Chip BGA) | 1152-ball FC-BGA (FF35) |
| 실장 유형 | Surface Mount | Surface Mount (BGA) |
| 동작 온도 | 0C to +85C (Commercial) | — |
| RoHS 상태 | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | [DATA_NEEDED: lead-free status] |
| Memory Bits | — | 23,105,536 bits (~22 Mbit) |
| Maximum User I/Os | — | 564 |
| Number of LABs/CLBs | — | 14144 |
| Transceivers | — | [DATA_NEEDED: transceiver count and data rate] |
| Core Voltage | — | 0.9 V |
| Operating Temperature Grade | — | Commercial (C4) |
| Series | — | Stratix IV GX |
| Part Status | — | Obsolete (per Micropcba / distributor listings) |