EP4SGX360FH29C4 vs EP4SGX360FH29C3 Comparación
Comparación detallada lado a lado de EP4SGX360FH29C4 por Intel y EP4SGX360FH29C3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX360FH29C4 | EP4SGX360FH29C3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.225,00 | $1.395,00 |
| Series | Stratix IV GX | — |
| Family | Stratix IV | Stratix IV GX |
| Logic Elements | 353,600 | 353,600 |
| Adaptive Logic Modules (ALMs) | 141,440 | 14144 LABs |
| Logic Array Blocks (LABs) | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| User I/Os | 289 | — |
| Transceivers | [DATA_NEEDED: number of transceivers and max data rate] | Multi-gigabit serial transceivers (per device variant) |
| Core Voltage | 0.9 V | 0.9 V |
| Process Node | 40 nm | — |
| Temperatura de funcionamiento | 0 C to +85 C (commercial, C4 grade) | Commercial (0C to +85C) |
| Encapsulado | 780-ball FC-HFBGA (HBGA-780), 33 x 33 mm | 780-FCBGA (HBGA-780), 33 x 33 mm |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Estado RoHS | Compliant | — |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free and halogen-free status] | — |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Configuration Method | JTAG / Fast Passive Parallel / Active Serial | — |
| Maximum User I/Os | — | 289 |
| Process Technology | — | 40 nm CMOS |
| Embedded Memory | — | 22.4 Mbits (M9K + M144K blocks) |
| Embedded 18x18 Multipliers | — | Up to 1,040 |
| Memory Standards Supported | — | DDR/DDR2/DDR3 SDRAM, QDRII/RLDRAM II |
| Hard IP Blocks | — | PCIe Gen1/Gen2, CPRI, OBSAI, Serial RapidIO |
| Speed Grade | — | C3 |