EP4SGX360FH29C4 vs EP4SGX360FH29C3 对比
详细并排对比 EP4SGX360FH29C4 出自 Intel 和 EP4SGX360FH29C3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP4SGX360FH29C4 | EP4SGX360FH29C3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $3,225.00 | $1,395.00 |
| Series | Stratix IV GX | — |
| Family | Stratix IV | Stratix IV GX |
| Logic Elements | 353,600 | 353,600 |
| Adaptive Logic Modules (ALMs) | 141,440 | 14144 LABs |
| Logic Array Blocks (LABs) | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| User I/Os | 289 | — |
| Transceivers | [DATA_NEEDED: number of transceivers and max data rate] | Multi-gigabit serial transceivers (per device variant) |
| Core Voltage | 0.9 V | 0.9 V |
| Process Node | 40 nm | — |
| 工作温度 | 0 C to +85 C (commercial, C4 grade) | Commercial (0C to +85C) |
| 封装 | 780-ball FC-HFBGA (HBGA-780), 33 x 33 mm | 780-FCBGA (HBGA-780), 33 x 33 mm |
| 安装类型 | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS 状态 | Compliant | — |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free and halogen-free status] | — |
| MSL 等级 | [DATA_NEEDED: MSL rating] | — |
| Configuration Method | JTAG / Fast Passive Parallel / Active Serial | — |
| Maximum User I/Os | — | 289 |
| Process Technology | — | 40 nm CMOS |
| Embedded Memory | — | 22.4 Mbits (M9K + M144K blocks) |
| Embedded 18x18 Multipliers | — | Up to 1,040 |
| Memory Standards Supported | — | DDR/DDR2/DDR3 SDRAM, QDRII/RLDRAM II |
| Hard IP Blocks | — | PCIe Gen1/Gen2, CPRI, OBSAI, Serial RapidIO |
| Speed Grade | — | C3 |