EP4SGX360FH29C4N vs EP4SGX360FH29C2XN Comparación
Comparación detallada lado a lado de EP4SGX360FH29C4N por Intel y EP4SGX360FH29C2XN por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX360FH29C4N | EP4SGX360FH29C2XN |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4.850,00 | $2.210,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements (LE) | 353,600 | — |
| LABs/CLBs | 14,144 | — |
| Total Memory Bits | 23,105,536 | — |
| Number of User I/Os | 289 | — |
| Temperatura de funcionamiento | 0C to 85C (commercial) | — |
| Encapsulado | 780-FCBGA, FC-HFBGA (FH29) | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | C4 (mid-tier) | C2 |
| Number of Transceivers | 24 (up to 8.5 Gbps) | — |
| Embedded Multipliers (18x18) | 1,288 | — |
| Nivel de sensibilidad a la humedad (MSL) | 3 (168 Hours) | — |
| Peak Reflow Temperature | 40 s max | — |
| Estado RoHS | Compliant / Lead-free | Compliant |
| Tipo de montaje | Surface Mount | — |
| Series | — | EP4SGX |
| Logic Elements | — | 353,600 |
| Logic Array Blocks (LABs) | — | 14,144 |
| Embedded Memory (bits) | — | 23,105,536 |
| Maximum User I/Os | — | 289 |
| Number of Terminals | — | 780 |
| Package Type | — | 780-ball FCBGA (H-BGA) |
| Temperature Grade | — | Commercial C2 (0C to +85C) |
| Lead-Free (X suffix) | — | Yes |
| Configuration | — | Field Programmable Gate Array |