EP4SGX360HF35I3 vs EP4SGX360HF35C2 Comparación
Comparación detallada lado a lado de EP4SGX360HF35I3 por Intel y EP4SGX360HF35C2 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP4SGX360HF35C2 - Stratix IV GX FPGA, 353K LEs, 35x35mm FCBGA | Intel
EP4SGX360HF35C2 ✓ ActivoComparación de especificaciones
| Parámetro | EP4SGX360HF35I3 | EP4SGX360HF35C2 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $650,00 | $9.750,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV GX Field Programmable Gate Array | Stratix IV GX FPGA |
| Logic Elements (LEs) | 353,600 | 353,600 |
| Total LABs | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | 23,105,536 |
| User I/Os | 564 | — |
| Core Voltage | 0.9 V | 0.9 V |
| Temperatura de funcionamiento | -40 °C to +100 °C (Industrial) | 0C to +85C (commercial) |
| Package Type | 1152-Ball FCBGA (FineLine BGA) | 1152-pin FC-FBGA |
| Speed Grade | F35 | — |
| Process Technology | 40 nm | 40 nm |
| I/O Standards Supported | LVDS, LVTTL, LVPECL, HSTL, SSTL | — |
| Embedded Transceivers | Yes (multi-gigabit) | — |
| DSP Blocks | Yes (hard DSP blocks) | — |
| Estado RoHS | Compliant | Compliant |
| Configuration Modes | Serial, Parallel, JTAG, Active Serial | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| LABs/CLBs | — | 14,144 |
| Number of I/O | — | 564 (max 532 user I/O) |
| Number of Logic Cells | — | 353,600 |
| Transceivers | — | Multi-gigabit serial transceivers (PCIe Gen2/XAUI/CEI-6G capable) |
| Package Code | — | HF35 (35x35 mm, 1.0 mm pitch) |
| Configuration | — | JTAG / Active Serial (external config device) |
| Design Tool | — | Quartus II / Quartus Prime |