EP4SGX360KF40C2 vs EP4SGX360KF40I4N Comparación
Comparación detallada lado a lado de EP4SGX360KF40C2 por Intel y EP4SGX360KF40I4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX360KF40C2 | EP4SGX360KF40I4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $10.400,00 | $3.100,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Process Technology | 40 nm | 40 nm |
| Logic Elements (LE) | 353,600 | — |
| Adaptive Logic Modules (ALM) | 212,160 (estimated from LE) | — |
| Embedded Memory (Bits) | 23,105,536 (17.7 Mbits M20K) | — |
| User I/O Count | 744 | — |
| Transceiver Count | Up to 24 | — |
| Max Transceiver Data Rate | 8.5 Gbps | — |
| PCIe Hard IP | PCIe Gen2 x8 (Gen1 compatible) | — |
| DSP Blocks | 1,040 (variable precision) | [DATA_NEEDED: number of DSP blocks and 18x18 multiplier count] |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | C2 (commercial) | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | — |
| Encapsulado | 1517-ball FCBGA, 42.5 x 42.5 mm | 1517-BBGA, FCBGA (Flip-Chip BGA) |
| Tipo de montaje | Surface Mount (flip-chip BGA) | Surface Mount |
| Nivel MSL | MSL3 (per JEDEC J-STD-020) | [DATA_NEEDED: MSL moisture sensitivity level] |
| Estado RoHS | Compliant | Compliant |
| Logic Elements | — | 353600 |
| Adaptive Logic Modules (ALMs) | — | 141440 |
| LABs/CLBs | — | 14144 |
| Number of I/O | — | 744 |
| Embedded Memory Bits | — | 23105536 |
| Package Pin/Ball Count | — | 1517 |
| Operating Temperature Grade | — | Industrial (I4 suffix) |
| Lead Free | — | Yes |
| Transceivers | — | [DATA_NEEDED: number of embedded transceivers and max data rate] |